Patents by Inventor Benjamin I. Goldberg

Benjamin I. Goldberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220361974
    Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.
    Type: Application
    Filed: July 18, 2022
    Publication date: November 17, 2022
    Applicant: President and Fellows of Harvard College
    Inventors: Joshua B. Gafford, Samuel B. Kesner, Conor J. Walsh, Michael Karpelson, Robert J. Wood, Zivthan Dubrovsky, Benjamin I. Goldberg, Kathleen O'Donnell, Michael J. Smith
  • Patent number: 11419693
    Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: August 23, 2022
    Assignee: President and Fellows of Harvard College
    Inventors: Joshua B. Gafford, Samuel B. Kesner, Conor J. Walsh, Michael Karpelson, Robert J. Wood, Zivthan Dubrovsky, Benjamin I. Goldberg, Kathleen O'Donnell, Michael J. Smith
  • Publication number: 20200015920
    Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.
    Type: Application
    Filed: July 30, 2019
    Publication date: January 16, 2020
    Applicant: President and Fellows of Harvard College
    Inventors: Joshua B. Gafford, Samuel B. Kesner, Conor J. Walsh, Michael Karpelson, Robert J. Wood, Zivthan Dubrovsky, Benjamin I. Goldberg, Kathleen O'Donnell, Michael J. Smith
  • Patent number: 10376326
    Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: August 13, 2019
    Assignee: President and Fellows of Harvard College
    Inventors: Joshua B. Gafford, Samuel B. Kesner, Conor J. Walsh, Michael Karpelson, Robert J. Wood, Zivthan Dubrovsky, Benjamin I. Goldberg, Kathleen O'Donnell, Michael J. Smith
  • Publication number: 20160184041
    Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.
    Type: Application
    Filed: August 4, 2014
    Publication date: June 30, 2016
    Applicant: President and Fellows of Harvard College
    Inventors: Joshua B. Gafford, Samuel B. Kesner, Conor J. Walsh, Michael Karpelson, Robert J. Wood, Zivthan Dubrovsky, Benjamin I. Goldberg, Kathleen O'Donnell, Michael J. Smith