Abstract: An apparatus for electrostatically applying a powder material to substrates is disclosed. The apparatus comprises a plurality of platens, each platen being arranged to hold a plurality of substrates, wherein each platen comprises an electrically conducting platen base having a plurality of supports for supporting a plurality of substrates, an electrically conducting platen shield located on the platen base and having a plurality of holes arranged to align with the plurality of supports on the platen base, an insulating coating provided between the platen base and the platen shield, a conveyor for conveying the platens along a path, and an applicator for applying the powder material to the substrates.

Abstract: There is provided and apparatus and method for electrostatically applying a powder material to substrates. The apparatus includes a plurality of platens, each platen being arranged to hold a plurality of substrates, a conveyor for conveying the platens along a path and an applicator for applying the powder material to the substrates. The method includes the steps of placing the substrates on platens, each platen holding a plurality of substrates, conveying the platens in series along a path and electrostatically applying a powder material to the substrates held on the platens. There is also provided a platen for holding a plurality of substrates to which powder material is to be electrostatically applied, the platen comprising a platen base having a plurality of supports for supporting a plurality of substrates and an electrically conducting platen shield located on the platen base and having a plurality of holes arranged to align with the plurality of supports on the platen base.