Abstract: Packages and methods of assembly are described in which barriers are utilized during overmolding to improve volumetric efficiency. In one embodiment, a barrier includes multiple variable height components located on an interior of the barrier, where the barrier prevents the variable height components from being overmolded during the encapsulation process. In one embodiment, a barrier includes a camera module mounted on an image sensor located on an interior of the barrier, where the barrier prevents the camera module and image sensor from being overmolded during the encapsulation process. In an embodiment, a barrier is mounted on a secondary tier with the secondary tier mounted on a primary tier, where the barrier prevents multiple connector components located on an interior of the barrier from being overmolded during the encapsulation process.

Abstract: Interlacing equipment may be used to form fabric such as woven fabric. The woven fabric may include warp strands and weft strands. In a Leno weave, a warp strand may include one or more covering strands twisted around a core strand. The covering strands and/or the core strand may be conductive to form a conductive warp strand. An electrical component may be mounted to the conductive warp strand. A first electrical connection may couple the electrical component to the core strand and a second electrical connection may couple the electrical component to the covering strand. The two electrical connections may be isolated from one another. A warp strand may have a first region in which the core includes a conductive strand and a second region in which the conductive strand forms part of the covering or is located on an outer surface of the covering.

Abstract: Interlacing equipment may be used to form fabric. A component detector may be used to feed strands such as a conductive strand to the interlacing equipment. One or more electrical components may be mounted to the conductive strand. The component detector may have a sensor configured to detect the presence of the electrical component as the conductive strand is fed to the interlacing equipment through the component detector. In response to detecting the component with the sensor, the interlacing equipment may automatically adjust interlacing operations in preparation for receiving the electrical component. For example, needles may be lowered in a knitting system, select warp strands may be raised and lowered in a weaving system, or a carrier may follow a modified path in a braiding system in response to detecting the electrical component. The fabric may have a different construction in regions where the electrical component is received.

Abstract: Knitting equipment may be used to form warp knit fabric. The warp knit fabric may be a spacer fabric having a spacer strand that travels back and forth between outer warp knit layers. The spacer fabric may include a pocket for receiving an electrical component. The electrical component may be mounted to an inlaid conductive strand that floats between the outer warp knit layers and that is held in place by the spacer strand. The pocket may be one of multiple pockets in the spacer fabric that are separated from one another by the spacer strand. Braiding equipment may include carriers that braid strands around an electrical component while a tool holds the electrical component in place. A ring may be used to isolate the braiding angle from the carriers to accommodate component insertion. The electrical component may be mounted to an inlaid conductive strand in the braid.

Abstract: Electrodes that can be formed in a flexible band of a wrist-worn device to detect hand gestures are disclosed. Multiple rows of electrodes can be configured to detect electromyography (EMG) signals produced by activity of muscles and tendons. The band can include removable electrical connections (e.g., pogo pins) to enable the electrode signals to be routed to processing circuitry in the housing of the wrist-worn device. Measurements between signals from the active electrodes and one or more reference electrodes can be obtained to capture EMG signals at a number of locations on the band. The measurement method and mode of operation (lower power coarse detection or higher power fine detection) can determine the location and number of electrodes to be measured. These EMG signals can be processed to identify hand movements and recognize gestures associated with those hand movements.

Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

Abstract: A fabric-based item may be provided with a stretchable band. The stretchable band may be formed from a ring-shaped strip of stretchable fabric having an opening configured to fit around a body part of a user. Circuitry may be coupled to strands of material in the stretchable band. The circuitry may include sensor circuitry for making measurements on the body part such as electrocardiogram measurements, blood pressure measurements, and respiration rate measurements. Wireless communications circuitry in the fabric-based item may be used to communicate wirelessly with external electronic equipment. A wireless power transmitting device may transmit wireless power. A coil formed from conductive strands in the fabric-based item may be used by wireless power receiving circuitry in the fabric-based item to receive the wireless power. The coil may have one or more turns that run around the ring-shaped strip of stretchable fabric.

Abstract: Electrodes that can be formed in a flexible band of a wrist-worn device to detect hand gestures are disclosed. Multiple rows of electrodes can be configured to detect electromyography (EMG) signals produced by activity of muscles and tendons. The band can include removable electrical connections (e.g., pogo pins) to enable the electrode signals to be routed to processing circuitry in the housing of the wrist-worn device. Measurements between signals from the active electrodes and one or more reference electrodes can be obtained to capture EMG signals at a number of locations on the band. The measurement method and mode of operation (lower power coarse detection or higher power fine detection) can determine the location and number of electrodes to be measured. These EMG signals can be processed to identify hand movements and recognize gestures associated with those hand movements.

Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.

Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.

Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

Abstract: A stretchable fabric signal path may include a conductive strand located between first and second outer fabric layers. The outer fabric layers may be formed from intertwined strands of elastic material. The conductive strand may have a wavy shape to accommodate stretching of the stretchable fabric signal path. First and second inner fabric layers may be located between the outer stretchable fabric layers. The inner fabric layers may be formed from intertwined strands of non-elastic material. The inner fabric layers may have strands that are intertwined with the outer fabric layers to serve as anchor points for maintaining the shape of the conductive strand as the stretchable fabric signal path expands and contracts. The outer fabric layers and inner fabric layers may be woven. The conductive strand may convey electrical signals such as audio signals, power signals, data signals, or other suitable signals.

Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

Abstract: A fabric-based item may include fabric formed from intertwined strands of material. The fabric may include first and second fabric layers that at least partially surround a pocket. Initially, the pocket may be completely enclosed by the first and second layers of fabric. A shim may be placed in the pocket before the pocket is closed. An opening may be formed in the first layer of fabric to expose a conductive strand in the pocket. The shim may prevent the cutting tool from cutting all the way through to the second layer of fabric. After cutting the hole in the first layer of fabric, the shim may be removed and an electrical component may be soldered to the conductive strand in the pocket. A polymer material may be injected into the pocket to encapsulate the electrical component. The polymer material may interlock with the surrounding pocket walls.

Abstract: Electrodes that can be formed in a flexible band of a wrist-worn device to detect hand gestures are disclosed. Multiple rows of electrodes can be configured to detect electromyography (EMG) signals produced by activity of muscles and tendons. The band can include removable electrical connections (e.g., pogo pins) to enable the electrode signals to be routed to processing circuitry in the housing of the wrist-worn device. Measurements between signals from the active electrodes and one or more reference electrodes can be obtained to capture EMG signals at a number of locations on the band. The measurement method and mode of operation (lower power coarse detection or higher power fine detection) can determine the location and number of electrodes to be measured. These EMG signals can be processed to identify hand movements and recognize gestures associated with those hand movements.

Abstract: One or more electrical components may be incorporated into a piece of fabric. The electrical component may include an internal portion that is located inside of the fabric, an external portion that is located on an exterior surface of the fabric, and protrusions that extend through the fabric to electrically and/or mechanically couple the internal and external portions of the electrical component. The internal portion of the component may be inserted into the fabric during formation of the fabric. The external portion of the component may be coupled to the internal portion after the fabric is formed by inserting the protrusions on the internal portion into recesses in the external portion. The external portion of the component may contain skin-facing and/or viewer-facing input-output devices, while the internal portion may contain circuitry that electrically communicates with the input-output devices in the external portion.

Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.