Patents by Inventor Benjamin J. Haass

Benjamin J. Haass has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8472278
    Abstract: Circuits, systems, and related methods to measure a performance characteristic(s) associated with a semiconductor die and adjust a clock signal based on the measured performance characteristic(s) are provided. The adjusted clock signal can be used to provide a clock signal to a functional circuit provided in the semiconductor die to assure proper operation of the functional circuit while operating with performance, voltage, temperature (PVT) delay variations. In this regard, a performance monitoring circuit is provided in the semiconductor die that includes the functional circuit. As a result, the performance monitoring circuit may be exposed to similar delay variations as the functional circuit. The performance monitoring circuit is configured to measure a performance characteristic(s) associated with the semiconductor die.
    Type: Grant
    Filed: April 9, 2010
    Date of Patent: June 25, 2013
    Assignee: QUALCOMM Incorporated
    Inventors: Benjamin J. Haass, William J. McAvoy
  • Publication number: 20110249525
    Abstract: Circuits, systems, and related methods to measure a performance characteristic(s) associated with a semiconductor die and adjust a clock signal based on the measured performance characteristic(s) are provided. The adjusted clock signal can be used to provide a clock signal to a functional circuit provided in the semiconductor die to assure proper operation of the functional circuit while operating with performance, voltage, temperature (PVT) delay variations. In this regard, a performance monitoring circuit is provided in the semiconductor die that includes the functional circuit. As a result, the performance monitoring circuit may be exposed to similar delay variations as the functional circuit. The performance monitoring circuit is configured to measure a performance characteristic(s) associated with the semiconductor die.
    Type: Application
    Filed: April 9, 2010
    Publication date: October 13, 2011
    Applicant: QUALCOMM INCORPORATED
    Inventors: Benjamin J. Haass, William J. McAvoy