Abstract: An optical filter device, system, and methods for improved optical rejection of high angle of incidence (AOI) light is disclosed. For example, an analyte detection system is provided that includes an excitation light source for illuminating an implantable sensor and an optical detector for collecting emission light from the implantable sensor. Further, the optical detector portion of the analyte detection system features an optical filter device including a surface-treated microchannel wherein the surface-treated microchannel serves to absorb, trap, and/or block high-AOI light. Further, a method of operation of the presently disclosed microchannel-based optical filter device including a surface-treated microchannel is provided with respect to the high optical rejection of high-AOI light.

Abstract: An optical filter device, system, and methods for improved optical rejection of high angle of incidence (AOI) light is disclosed. For example, an analyte detection system is provided that includes an excitation light source for illuminating an implantable sensor and an optical detector for collecting emission light from the implantable sensor. Further, the optical detector portion of the analyte detection system features an optical filter device including a surface-treated microchannel wherein the surface-treated microchannel serves to absorb, trap, and/or block high-AOI light. Further, a method of operation of the presently disclosed microchannel-based optical filter device including a surface-treated microchannel is provided with respect to the high optical rejection of high-AOI light.

Abstract: Light emitting diode components are disclosed that utilize a thin, substantially flat or undomed encapsulant in order to achieve the desired emission profile to increase luminance and/or center beam candle power. Some embodiments of the devices include encapsulants, which result in an apparent source image, which does not exceed 2× the source size. Different embodiments of the present invention can comprise different configurations of emitters within the component, such as monolithic chips. The LEDs can be wire bonded to a surface. This surface can be black, reflective or include a reflective coating. In some embodiments, conversion materials can be applied conformal to the LED.

Abstract: An LED package includes a LED structure that outputs light in a pattern about an axis and an optical coupling device with a central axis. The coupling device is positioned relative to the LED structure and accepts light from the LED. The coupling device includes a first dielectric interface surface that is substantially cylindrical with respect to the central axis, and a reflecting surface. The first dielectric interface surface accepts a first portion of light from the LED structure and directs it toward the reflecting surface. The reflecting surface accepts the light from the first dielectric interface surface and directs it toward the first dielectric interface surface in a direction substantially perpendicular to the central axis.

Abstract: An LED package includes a LED structure that outputs light in a pattern about an axis and an optical coupling device with a central axis. The coupling device is positioned relative to the LED structure and accepts light from the LED. The coupling device includes a first dielectric interface surface that is substantially cylindrical with respect to the central axis, and a reflecting surface. The first dielectric interface surface accepts a first portion of light from the LED structure and directs it toward the reflecting surface. The reflecting surface accepts the light from the first dielectric interface surface and directs it toward the first dielectric interface surface in a direction substantially perpendicular to the central axis.

Abstract: An LED package includes a LED structure that outputs light in a pattern about an axis and an optical coupling device with a central axis. The coupling device is positioned relative to the LED structure and accepts light from the LED. The coupling device includes a first dielectric interface surface that is substantially cylindrical with respect to the central axis, and a reflecting surface. The first dielectric interface surface accepts a first portion of light from the LED structure and directs it toward the reflecting surface. The reflecting surface accepts the light from the first dielectric interface surface and directs it toward the first dielectric interface surface in a direction substantially perpendicular to the central axis.

Abstract: An optical device for collecting light and selectively outputting or concentrating the light. A layer has an optical index of referaction n1, and top, bottom and side surfaces defining an angel of inclination ?. A back surface spans the top, bottom and side surface. A first layer is coupled to the bottom surface of the layer and has an index of refraction n2. The first layer index n2 causes light input through the back surface of the layer to be preferentially output into the first layer. A second layer is coupled to the bottom of the first layer and selectively causes output of light into ambient.

Abstract: An optical device for collecting light and selectively outputting or concentrating the light. A layer has an optical index of referaction n1, and top, bottom and side surfaces defining an angel of inclination ?. A back surface spans the top, bottom and side surface. A first layer is coupled to the bottom surface of the layer and has an index of refraction n2. The first layer index n2 causes light input through the back surface of the layer to be preferentially output into the first layer. A second layer is coupled to the bottom of the first layer and selectively causes output of light into ambient. Additional layers, such as alight polarization layer, a polarization converting layer and a post LCD diffuser layer can be used to make preferential use of polarized light of diffuse light having passed through the LCD layer to enhance viewing of the output light.

Abstract: A nonimaging optical system for processing a first and second light distribution. The nonimaging optical system includes at least two refractive surfaces, at least one reflective surface nearer to the first light distribution along at least one ray path than the nearer of the two refracting surfaces and the reflective surface and the refractive surfaces cooperating to redirect light edge rays of the first light distribution into the neighborhood of the edge of the second light distribution with a single reflection from the reflecting surface.

Abstract: An optical device for collecting light and selectively outputting or concentrating the light. A layer has an optical index of referaction n1, and top, bottom and side surfaces defining an angel of inclination ?. A back surface spans the top, bottom and-side surface. A first layer is coupled to the bottom surface of the layer and has an index of refraction n2. The first layer index n2 causes light input through the back surface of the layer to be preferentially output into the first layer. A second layer is coupled to the bottom of the first layer and selectively causes output of light into ambient. Additional layers, such, as alight polarization layer, a polarization converting layer and a post LCD diffuser layer can be used to make preferential use of polarized light of diffuse light having passed through the LCD layer to enhance viewing of the output light.

Abstract: An LED package includes a LED structure that outputs light in a pattern about an axis and an optical coupling device with a central axis. The coupling device is positioned relative to the LED structure and accepts light from the LED. The coupling device includes a first dielectric interface surface that is substantially cylindrical with respect to the central axis, and a reflecting surface. The first dielectric interface surface accepts a first portion of light from the LED structure and directs it toward the reflecting surface. The reflecting surface accepts the light from the first dielectric interface surface and directs it toward the first dielectric interface surface in a direction substantially perpendicular to the central axis.

Abstract: An optical device for collecting light and selectively outputting or concentrating the light. A layer has an optical index of referaction n1, and top, bottom and side surfaces defining an angel of inclination ?. A back surface spans the top, bottom and side surface. A first layer is coupled to the bottom surface of the layer and has an index of refraction n2. The first layer index n2 causes light input through the back surface of the layer to be preferentially output into the first layer. A second layer is coupled to the bottom of the first layer and selectively causes output of light into ambient. Additional layers, such as alight polarization layer, a polarization converting layer a and a post LCD diffuser layer can be used to make preferential use of polarized light of diffuse light having passed through the LCD layer to enhance viewing of the output light.

Abstract: An LED light source using back-reflecting collection optics with a supporting structure and heat sink to block only a small amount of light. A reflector has a front and back side with an LED positioned on the front side of the reflector. A heat conducting body is positioned at least partially between the reflector and the LED. The heat conducting body provides a pathway for heat to flow from the LED toward the back side of the reflector.

Abstract: Stacked LAN connector (10) adapted for mounting to a circuit board (24) and including a stacked USB component (150) and a modular jack component (200) secured in respective portions of main housing (50), around which is an outer shield (32). An inner shield (130) shields the arrays of contacts of the modular jack component (200) and the stacked USB component (150) as they depend from the board mounting face to be connected to circuits of the circuit board (24). LEDs (28,30) indicate full mating by a modular plug with the modular jack component. The connector saves board real estate otherwise occupied by a modular jack positioned beside a stacked USB connector on the circuit board.