Patents by Inventor Benjamin James Fletcher

Benjamin James Fletcher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162936
    Abstract: The present disclosure provides a method and apparatus for communicating between dice of an inductively-coupled 3D integrated circuit (3D-IC). A transmit resonant circuit at a transmit die is inductively coupled to a first receive resonant circuit at a first receive die, and to a second receive resonant circuit at a second receive die. The resonant circuit at the targeted receive die is tuned to the frequency of resonance of the transmit resonant circuit, while the resonant circuit at the untargeted receive die is detuned, resulting in lower power consumption for a given bit error rate at the targeted die.
    Type: Application
    Filed: February 28, 2022
    Publication date: May 16, 2024
    Applicants: Arm Limited, ECS Partners Limited
    Inventors: Benjamin James Fletcher, James Edward Myers, Shidhartha Das, Sahan Sajeewa Hiniduma Udugama Gamage
  • Patent number: 11366779
    Abstract: A chip-carrier package includes a data processing system having one or more slave dies, a master die and a system bus. Each slave die includes a slave device and a slave-side wireless bus interface (WBI) coupled to the slave device. The master die includes a master device, one or more bus-side WBIs coupled to the master device. Each bus-side WBI is configured to be wirelessly coupled to at least one slave-side WBI of the one or more slave dies and a system bus. The system bus includes the one or more bus-side WBIs and the slave-side WBIs of the one or more slave-side dies. The system bus is configured to exchange information between the master device and the slave devices of the one or more slave dies.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: June 21, 2022
    Assignees: Arm Limited, ECS Partners Limited
    Inventors: Benjamin James Fletcher, James Edward Myers, Shidhartha Das, Terrence Sui Tung Mak
  • Publication number: 20210149834
    Abstract: A chip-carrier package includes a data processing system having one or more slave dies, a master die and a system bus. Each slave die includes a slave device and a slave-side wireless bus interface (WBI) coupled to the slave device. The master die includes a master device, one or more bus-side WBIs coupled to the master device. Each bus-side WBI is configured to be wirelessly coupled to at least one slave-side WBI of the one or more slave dies and a system bus. The system bus includes the one or more bus-side WBIs and the slave-side WBIs of the one or more slave-side dies. The system bus is configured to exchange information between the master device and the slave devices of the one or more slave dies.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 20, 2021
    Applicants: Arm Limited, ECS Partners Limited
    Inventors: Benjamin James Fletcher, James Edward Myers, Shidhartha Das, Terrence Sui Tung Mak
  • Patent number: 10771187
    Abstract: A method and apparatus for transferring data maps the data to a modulation code using an encoder circuit having a configuration. A binary symbol of the data is mapped to a modulation code having a plurality of modulation digits and a modulation signal is generated based on the modulation code. A transmitter drive signal is modulated based on the modulation signal. A configuration of the encoder circuit is set based on a determined performance level. The transmitter drive signal may be used to produce an electromagnetic field by generating a positive, negative or zero electrical current in an induction coil of a first semiconductor die. A current induced by the electromagnetic field in an induction coil of a second semiconductor die is demodulated to recover the data whereby the data is transferred from the first semiconductor die to the second semiconductor die.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: September 8, 2020
    Assignees: Arm Limited, ECS Partners Limited
    Inventors: Sahan Sajeewa Hiniduma Udugama Gamage, Benjamin James Fletcher, Shidhartha Das