Patents by Inventor Benjamin Lack

Benjamin Lack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250173787
    Abstract: This disclosure relates to a lending system comprising a processor, a memory, and at least one network interface controller configured to enable data exchange with external systems. The memory includes lending management logic configured to execute a personal loan-lending system wherein one or more loans are generated by collecting and preprocessing borrower data from multiple sources, conducting risk assessment and scoring, generating one or more scores based on the conducted risk assessment, and approving loans based on the generated scores. The system leverages machine learning processes to refine scoring accuracy and dynamically adapt to borrower profiles and external conditions. The system may integrate with third-party data sources for enhanced verification and incorporate compliance logic to ensure adherence to regulatory standards.
    Type: Application
    Filed: January 28, 2025
    Publication date: May 29, 2025
    Applicant: loanDepot.com, LLC
    Inventors: Eileen Kim, Anne Eckles, Benjamin Lack, Maja Todorovic
  • Publication number: 20230260020
    Abstract: Disclosed herein is a personal loan-lending system including, in some embodiments, a personal loan-originating system configured for originating personal loans, a personal loan-servicing system configured for servicing the personal loans, and third-party integration supporting the originating or the servicing of the personal loans. The third-party integration includes one or more application programming interfaces configured for transferring loan-related information between the personal loan-lending system and third parties such as credit bureaus, employment verification providers, or the like. The personal loan-lending system includes one or more server hosts supporting a personal loan-originating application stack and a personal loan-servicing application stack. Also disclosed herein are methods of the personal loan-lending system.
    Type: Application
    Filed: April 25, 2023
    Publication date: August 17, 2023
    Applicant: loanDepot.com, LLC
    Inventors: Eileen Kim, Anne Eckles, Benjamin Lack, Maja Todorovic
  • Publication number: 20190385228
    Abstract: Disclosed herein is a personal loan-lending system including, in some embodiments, a personal loan-originating system configured for originating personal loans, a personal loan-servicing system configured for servicing the personal loans, and third-party integration supporting the originating or the servicing of the personal loans. The third-party integration includes one or more application programming interfaces configured for transferring loan-related information between the personal loan-lending system and third parties such as credit bureaus, employment verification providers, or the like. The personal loan-lending system includes one or more server hosts supporting a personal loan-originating application stack and a personal loan-servicing application stack. Also disclosed herein are methods of the personal loan-lending system.
    Type: Application
    Filed: June 17, 2019
    Publication date: December 19, 2019
    Applicant: loanDepot.com, LLC
    Inventors: Eileen Kim, Anne Eckles, Benjamin Lack, Maja Todorovic