Abstract: The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.

Abstract: Embodiments described herein provide a system, a software application, and methods of a lithography process that provide at least one of the ability to decrease the stabilization time and write an exposure pattern into a photoresist on a substrate compensating for the change in the total pitch over a stabilization time. One embodiment of the system includes a slab, a stage disposed over the slab, a pair of supports disposed on the slab, a processing apparatus, and a chiller system. The pair of supports support a pair of tracks and the stage is configured to move along the pair of tracks. The processing apparatus has an apparatus support coupled to the slab and a processing unit supported by the apparatus support. The processing unit has a plurality of image projection systems. The chiller system has at least one fluid channel disposed in each track of the pair of tracks.

Abstract: The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.

Abstract: Embodiments described herein provide a system, a software application, and methods of a lithography process that provide at least one of the ability to decrease the stabilization time and write an exposure pattern into a photoresist on a substrate compensating for the change in the total pitch over a stabilization time. One embodiment of the system includes a slab, a stage disposed over the slab, a pair of supports disposed on the slab, a processing apparatus, and a chiller system. The pair of supports support a pair of tracks and the stage is configured to move along the pair of tracks. The processing apparatus has an apparatus support coupled to the slab and a processing unit supported by the apparatus support. The processing unit has a plurality of image projection systems. The chiller system has at least one fluid channel disposed in each track of the pair of tracks.

Abstract: Embodiments described herein provide a system, a software application, and methods of a lithography process that provide at least one of the ability to decrease the stabilization time and write an exposure pattern into a photoresist on a substrate compensating for the change in the total pitch over a stabilization time. One embodiment of the system includes a slab, a stage disposed over the slab, a pair of supports disposed on the slab, a processing apparatus, and a chiller system. The pair of supports support a pair of tracks and the stage is configured to move along the pair of tracks. The processing apparatus has an apparatus support coupled to the slab and a processing unit supported by the apparatus support. The processing unit has a plurality of image projection systems. The chiller system has at least one fluid channel disposed in each track of the pair of tracks.

Abstract: Embodiments described herein provide a system, a software application, and methods of a lithography process that provide at least one of the ability to decrease the stabilization time and write an exposure pattern into a photoresist on a substrate compensating for the change in the total pitch over a stabilization time. One embodiment of the system includes a slab, a stage disposed over the slab, a pair of supports disposed on the slab, a processing apparatus, and a chiller system. The pair of supports support a pair of tracks and the stage is configured to move along the pair of tracks. The processing apparatus has an apparatus support coupled to the slab and a processing unit supported by the apparatus support. The processing unit has a plurality of image projection systems. The chiller system has at least one fluid channel disposed in each track of the pair of tracks.

Abstract: The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.

Abstract: Processing systems and methods used in the manufacturing of flat panel displays (FPDs) are provided herein. In one embodiment, a processing system features a motion stage movably disposed on a base surface, one or more X-position interferometers, and a plurality of Y-position interferometers. The X-position interferometers include an X-position mirror fixedly coupled to the motion stage and an X-axis stationary module fixedly coupled a non-moving surface of processing system. Each of the plurality of Y-position interferometers include one of a first or second Y-position mirror fixedly coupled to the motion stage in orthogonal relationship to the one or more X-position mirrors and one of a first or a second Y-axis stationary module fixedly coupled to a non-moving surface of the processing system. Here, each of the Y-axis stationary modules is positioned to direct coherent radiation towards a respective Y-position mirror when the Y-position interferometer thereof is in an active arrangement.

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.

Abstract: Embodiments of the present disclosure generally relate to systems and methods for performing photolithography processes. In one embodiment, laminar gas flow is provided inside a photolithography system during operation. With laminar gas flow instead of turbulent gas flow inside the system, accuracy of the measurement of the location of a substrate disposed inside the system is improved due to the improved signal integrity of interferometers.

Abstract: Systems and apparatus for performing photolithography processes are described. The system and apparatus may comprise a slab, at least one stage disposed on the slab, and a vibration damping system disposed on the slab, the vibration damping system comprising a weight that is substantially equal to a weight of one of the at least one stage and a substrate that moves simultaneously with movement of the one of the at least one stage.

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.

Abstract: A segmented antenna assembly for use in a plasma enhanced chemical vapor deposition (PECVD) apparatus. One embodiment provides an apparatus comprising a chamber body having a top surface and a bottom surface, an antenna comprising a first segment, a second segment electrically coupled to the first segment and extending through an interior volume of the chamber, and a third segment electrically coupled to the second segment, and a dielectric layer disposed around an outer diameter of the second segment.

Abstract: Embodiments of the present disclosure generally relate to systems and methods for performing photolithography processes. In one embodiment, laminar gas flow is provided inside a photolithography system during operation. With laminar gas flow instead of turbulent gas flow inside the system, accuracy of the measurement of the location of a substrate disposed inside the system is improved due to the improved signal integrity of interferometers.

Abstract: Systems and apparatus for performing photolithography processes are described. The system and apparatus may comprise a slab, at least one stage disposed on the slab, and a vibration damping system disposed on the slab, the vibration damping system comprising a weight that is substantially equal to a weight of one of the at least one stage and a substrate that moves simultaneously with movement of the one of the at least one stage.

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.

Abstract: An apparatus for introducing gas into a processing chamber comprising one or more gas distribution tubes having gas-injection holes which may be larger in size, greater in number, and/or spaced closer together at sections of the gas introduction tubes where greater gas conductance through the gas-injection holes is desired. An outside tube having larger gas-injection holes may surround each gas distribution tube. The gas distribution tubes may be fluidically connected to a vacuum foreline to facilitate removal of gas from the gas distribution tube at the end of a process cycle.

Abstract: A bellows which forms a flexible coupling between the lid of a processing chamber and an antenna feed through. One embodiment provides an apparatus comprising a chamber body having a chamber lid, a feed through extending through the chamber lid, an antenna coupled to and extending through the feed through to an internal volume of the chamber body, and a bellows comprising a first flange, the first flange coupled to the feed through, a second flange, the second flange coupled to the chamber lid, and a center portion extending between the first flange and the second flange.

Abstract: A segmented antenna assembly for use in a plasma enhanced chemical vapor deposition (PECVD) apparatus. One embodiment provides an apparatus comprising a chamber body having a top surface and a bottom surface, an antenna comprising a first segment, a second segment electrically coupled to the first segment and extending through an interior volume of the chamber, and a third segment electrically coupled to the second segment, and a dielectric layer disposed around an outer diameter of the second segment.