Patents by Inventor Benjamin M. Mikulis, Jr.

Benjamin M. Mikulis, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4064356
    Abstract: A soldered joint between a thin flat conductive lead and a flat conductive pad in which the lead is "rippled," that is, formed with undulations each of which engages the surface of the pad so that during soldering, the molten solder fills the spaces between the pad and the lead and then solidifies forming the soldered joint.
    Type: Grant
    Filed: March 11, 1976
    Date of Patent: December 20, 1977
    Assignee: Sander Associates, Inc.
    Inventors: Norman O. Marler, Jr., Benjamin M. Mikulis, Jr.