Abstract: A method of fabricating a flexible battery comprises forming a first substrate on a first release liner, forming at least one current collector layer on each of the first and second substrate, forming an anode side of the battery by forming an anode on the current collector of the first substrate, forming a cathode side of the battery by forming a cathode on the current collector of the second substrate, depositing electrolyte on one or both of the anode and cathode, adhering and sealing the anode side and cathode side together such that the anode and cathode face one another with the electrolyte In between, and removing the flexible battery from the release liners. The battery may be a primary battery or a secondary battery. The method may be implemented using a roll-to-roll process.

Abstract: A method of connecting a plurality of electronic components to a flexible circuit board comprises: providing a carrier substrate carrying the electronic components, each of the electronic components having at least one electrical contact coated with electrically conductive adhesive; and applying the carrier substrate to the flexible circuit board such that the electronic components are adhered to the flexible circuit board in electrical contact therewith via the conductive adhesive. The electronic components may comprise LEDs and there may be provided one or more optical layers over the flexible circuit board.

Abstract: A method of connecting a plurality of electronic components (103) to a flexible circuit board (107) comprises: providing a carrier substrate (105) carrying the electronic components (103), each of the electronic components (103) having at least one electrical contact coated with electrically conductive adhesive (102); and applying the carrier substrate (105) to the flexible circuit board (106) such that the electronic components (103) are adhered to the flexible circuit board (106) in electrical contact therewith via the conductive adhesive (102). The electronic components (103) may comprise LEDs and there may be provided one or more optical layers over the flexible circuit board (106).