Abstract: Ceramic armor having a ceramic material encapsulated within a metal frame assembly and an alloy joint formed therebetween. A hot pressing procedure is carried out on the metal frame assembly containing the ceramic material and braze composition to cause the metal to plastically deform about the encapsulated ceramic material and form a diffusion bonded metal frame assembly and an alloy joint formed in-situ from the braze composition, which melts and wets the ceramic material and the metal frame assembly during the process of diffusion bonding the components of the metal frame assembly together. In instances of a titanium frame assembly, a silicon carbide ceramic material, and a copper-silicon braze composition, the alloy joint formed in-situ during the diffusion bonding process has an alloy gradient including a Cu—Ti component, a Ti—Cu—Si component, and a Cu—Si component.

Abstract: A susceptor including a substrate support and a conductor is provided. The substrate support includes a conductive element, a contact bonded to the conductive element, and a bushing. The conductor is disposed through the bushing and is bonded to the contact. The substrate support can also include a conductive spreader between the contact and the conductive element. A method for fabricating a susceptor is also provided. The method comprises forming a plate including a bushing preform, sintering or hot-pressing a conductive element and a contact between a ceramic layer and the plate to produce a substrate support, forming a conductor opening into the substrate support and through the bushing preform to the contact, and bonding a conductor into the conductor opening.