Patents by Inventor Benjamin R. Gray

Benjamin R. Gray has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240106153
    Abstract: A low-profile mezzanine connector. The connector is simple to manufacture and can be reliably formed even with a stack height of 4 mm or less yet has high signal integrity. The connector has a field of identically shaped contacts that are functionally differentiated through features of the housing, including lossy material in patches with narrower projections electrically coupled to contacts designated as ground contacts. The mating portions of the contacts are adjacent a wall of the housing, which is tapered to increase the effective dielectric constant in the vicinity of the signal contacts. Each contact may have a hole in it to engage an insertion tool to enable repeatable and stable insertion of the contacts into a housing. The footprint for mounting the connector to a PCB may include signal vias offset from the mounting pads for signal contacts.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 28, 2024
    Applicant: Amphenol Corporation
    Inventors: Mark R. Gray, Benjamin Reed Staudt
  • Publication number: 20230421676
    Abstract: A mobile phone may include an enclosure including a front cover assembly defining a front exterior surface of the enclosure, a rear cover assembly defining a rear exterior surface of the enclosure, and a housing subassembly positioned between the front cover assembly and the rear cover assembly. The housing subassembly may include a first housing component defining a first side exterior surface of the enclosure, a second housing component defining a second side exterior surface of the enclosure opposite the first side exterior surface of the enclosure, and a lower chassis section extending between the first housing component and the second housing component. The mobile phone may further include a camera array coupled to the lower chassis section and positioned in an interior cavity defined between the lower chassis section and the front cover assembly.
    Type: Application
    Filed: September 7, 2023
    Publication date: December 28, 2023
    Inventors: Jon F. Housour, Macey E. Dade, Benjamin R. Gray, Reema Shalan, Daniel W. Jarvis, Jason P. Shannon, Marwan Rammah, Robert F. Meyer, Richard H. Koch, Anthony B. Sinclair, Gareth L. Rose
  • Publication number: 20230421677
    Abstract: A mobile phone may include a housing. The housing may include a first housing component including a cladding portion formed from a first metal and defining a first portion of a side exterior surface of the mobile phone, and a core portion coupled to the cladding portion, the core portion defining a portion of an interior surface of the mobile phone and formed from a second metal different from the first metal, a second housing component defining a second portion of the side exterior surface of the mobile phone, and a joint structure coupled to the first housing component and the second housing component and defining a third portion of the side exterior surface of the mobile phone between the first portion of the side exterior surface and the second portion of the side exterior surface. The cladding portion may be bonded directly to the core portion.
    Type: Application
    Filed: September 7, 2023
    Publication date: December 28, 2023
    Inventors: Jon F. Housour, Macey E. Dade, Benjamin R. Gray, Reema Shalan, Daniel W. Jarvis, Jason P. Shannon, Marwan Rammah, Robert F. Meyer, Richard H. Koch, Lee E. Hooton, Christopher S. Tomasetta