Abstract: A low-profile mezzanine connector. The connector is simple to manufacture and can be reliably formed even with a stack height of 4 mm or less yet has high signal integrity. The connector has a field of identically shaped contacts that are functionally differentiated through features of the housing, including lossy material in patches with narrower projections electrically coupled to contacts designated as ground contacts. The mating portions of the contacts are adjacent a wall of the housing, which is tapered to increase the effective dielectric constant in the vicinity of the signal contacts. Each contact may have a hole in it to engage an insertion tool to enable repeatable and stable insertion of the contacts into a housing. The footprint for mounting the connector to a PCB may include signal vias offset from the mounting pads for signal contacts.

Abstract: Disclosed herein is a method. A first electrically conductive trace is provided on a substrate. A second electrically conductive trace is providing on the substrate proximate the first electrically conductive trace. A solder mask is provided at the first and the second electrically conductive traces. A portion of the first electrically conductive trace is free of any portion of the solder mask covering thereon.

Abstract: Disclosed herein is a method. A first electrically conductive trace is provided on a substrate. A second electrically conductive trace is providing on the substrate proximate the first electrically conductive trace. A solder mask is provided at the first and the second electrically conductive traces. A portion of the first electrically conductive trace is free of any portion of the solder mask covering thereon.

Abstract: Disclosed herein is a method. A first electrically conductive trace is provided on a substrate. A second electrically conductive trace is providing on the substrate proximate the first electrically conductive trace. A solder mask is provided at the first and the second electrically conductive traces. A portion of the first electrically conductive trace is free of any portion of the solder mask covering thereon.

Abstract: Disclosed herein is a method. A first electrically conductive trace is provided on a substrate. A second electrically conductive trace is providing on the substrate proximate the first electrically conductive trace. A solder mask is provided at the first and the second electrically conductive traces. A portion of the first electrically conductive trace is free of any portion of the solder mask covering thereon.