Abstract: A semiconductor device includes a carrier, a power semiconductor die that includes first and second opposite facing main surfaces, a side surface extending from the first main surface to the second main surface, and first and second electrodes disposed on the first and second main surfaces, respectively, a die attach material arranged between the carrier and the first electrode, wherein the die attach material forms a fillet at the side surface of the power semiconductor die, wherein a fillet height of the fillet is less than about 95% of a height of the power semiconductor die, wherein the height of the power semiconductor die is a length of the side surface, and wherein a maximum extension of the die attach material over edges of a main surface of the power semiconductor die facing the die attach material is less than about 200 micrometers.

Abstract: The invention relates to a game case (1) for the transport and mobile operation of an integratable game console, said game case (1) having an upper shell (2) and a lower shell (3) and the upper shell (2) being connected to the lower shell (3) removably or such that it can be folded along a longitudinal side. The upper shell (2) comprises a screen (4) for outputting a signal of the integratable game console and said screen (4) occupies at least half of the surface of the upper shell (2). The lower shell (3) comprises at least one shaped element (5) and said shaped element (5) has at least one recess (6) for interlockingly accommodating the games console. The game case (1) has a ready-made wiring (7) which comprises at least one power supply line (7a) or a signal line (7b), and at least one power supply lien (7a) or signal line (7b) is inserted into the recess (6) to connect to the game console for connection to a power source or to the screen (4) to output a signal of the game console.

Abstract: A semiconductor device includes a carrier, a power semiconductor die that includes first and second opposite facing main surfaces, a side surface extending from the first main surface to the second main surface, and first and second electrodes disposed on the first and second main surfaces, respectively, a die attach material arranged between the carrier and the first electrode, wherein the die attach material forms a fillet at the side surface of the power semiconductor die, wherein a fillet height of the fillet is less than about 95% of a height of the power semiconductor die, wherein the height of the power semiconductor die is a length of the side surface, and wherein a maximum extension of the die attach material over edges of a main surface of the power semiconductor die facing the die attach material is less than about 200 micrometers.

Abstract: A method includes providing a carrier, depositing a die attach material on the carrier, and arranging a semiconductor die on the die attach material, wherein a main surface of the semiconductor die facing the die attach material at least partly contacts the die attach material, wherein immediately after arranging the semiconductor die on the die attach material, a first maximum extension of the die attach material over edges of the main surface is less than about 100 micrometers.

Abstract: A method includes providing a carrier, depositing a die attach material on the carrier, and arranging a semiconductor die on the die attach material, wherein a main surface of the semiconductor die facing the die attach material at least partly contacts the die attach material, wherein immediately after arranging the semiconductor die on the die attach material, a first maximum extension of the die attach material over edges of the main surface is less than about 100 micrometers.

Abstract: A semiconductor device includes a carrier, a semiconductor die and a die attach material arranged between the carrier and the semiconductor die. A fillet height of the die attach material is less than about 95% of a height of the semiconductor die. A maximum extension of the die attach material over edges of a main surface of the semiconductor die facing the die attach material is less than about 200 micrometers.

Abstract: A semiconductor device includes a carrier, a semiconductor die and a die attach material arranged between the carrier and the semiconductor die. A fillet height of the die attach material is less than about 95% of a height of the semiconductor die. A maximum extension of the die attach material over edges of a main surface of the semiconductor die facing the die attach material is less than about 200 micrometers.

Abstract: A dispensing tool includes a dispensing outlet for depositing a specific amount of a mounting material on a carrier when the dispensing outlet is at a predetermined dispensing distance from the carrier. The dispensing tool also includes a protrusion element protruding past the dispensing outlet by spanning the dispensing distance between dispensing outlet and carrier during dispensing.