Patents by Inventor Benjamin Shafer

Benjamin Shafer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER PROFILING FOR ETCHING SYSTEM
    Publication number: 20230065641
    Abstract: A substrate etching system includes a support to hold a wafer in a face-up orientation, a dispenser arm movable laterally across the wafer on the support, the dispenser arm supporting a delivery port to selectively dispense a liquid etchant onto a portion of a top face of the wafer, and a monitoring system comprising a probe movable laterally across the wafer on the support.
    Type: Application
    Filed: November 9, 2022
    Publication date: March 2, 2023
    Inventors: Jeffrey Chi Cheung, John Ghekiere, Jerry D. Leonhard, David P. Surdock, Benjamin Shafer, Ray Young
  • Wafer profiling for etching system
    Patent number: 11501986
    Abstract: A substrate etching system includes a support to hold a wafer in a face-up orientation, a dispenser arm movable laterally across the wafer on the support, the dispenser arm supporting a delivery port to selectively dispense a liquid etchant onto a portion of a top face of the wafer, and a monitoring system comprising a probe movable laterally across the wafer on the support.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: November 15, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Chi Cheung, John Ghekiere, Jerry D. Leonhard, David P. Surdock, Benjamin Shafer, Ray Young
  • WAFER PROFILING FOR ETCHING SYSTEM
    Publication number: 20170323806
    Abstract: A substrate etching system includes a support to hold a wafer in a face-up orientation, a dispenser arm movable laterally across the wafer on the support, the dispenser arm supporting a delivery port to selectively dispense a liquid etchant onto a portion of a top face of the wafer, and a monitoring system comprising a probe movable laterally across the wafer on the support.
    Type: Application
    Filed: May 5, 2017
    Publication date: November 9, 2017
    Inventors: Jeffrey Chi Cheung, John Ghekiere, Jerry D. Leonhard, David P. Surdock, Benjamin Shafer, Ray Young
  • SEMICONDUCTOR WAFER CLEANING WITH DILUTE ACIDS
    Publication number: 20100024847
    Abstract: In a method for cleaning wafers using ultra-dilute acids, the wafers are placed into a rotor in a process chamber. As the rotor spins, the wafers are with de-ionized water and ultra-dilute hydrofluoric acid. Ozone gas is introduced into the process chamber. The wafers are then sprayed with an ultra-dilute solution of hydrochloric acid. Ozone gas is purged from the chamber. The wafers are then rinsed and dried. The ultra-dilute acids may be used in water to acid concentrations on the order of about 1000-2400:1.
    Type: Application
    Filed: August 1, 2008
    Publication date: February 4, 2010
    Inventors: Ronald G. Breese, Benjamin Shafer, Dana R. Scranton, Bruce J. Fender