Patents by Inventor Benjamin Shawley

Benjamin Shawley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stripline assembly having first and second pre-fired ceramic substrates bonded to each other through a conductive bonding layer
    Patent number: 9270003
    Abstract: The present invention is directed to a stripline assembly that includes a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate. A second pre-fired ceramic substrate includes a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface. The circuit is disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. A conductive bonding layer is disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: February 23, 2016
    Assignee: Anaren, Inc.
    Inventors: Benton O'Neil, Adam Cook, Benjamin Shawley
  • First and second microstrip networks stacked in an inverted arrangement to each other using an integrated support and shielding structure
    Patent number: 9178257
    Abstract: An assembly includes at least one first microstrip network having at least one first transmission line disposed on a first surface of a first dielectric layer including a first ground plane disposed on a second surface of the dielectric layer. At least one second microstrip network includes at least one second transmission line disposed on a first surface of a second dielectric layer, the second dielectric layer including a second ground plane disposed on a second surface of the second dielectric layer. The at least one second microstrip network is inverted relative to the at least one first microstrip network. At least one integrated support and shielding (ISS) structure is disposed between the second and the first microstrip network. The ISS structure includes a first cavity accommodating the first microstrip network and a second cavity accommodating the second microstrip network. The cavities are configured in accordance with RF performance criterions.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 3, 2015
    Assignee: Anaren, Inc.
    Inventors: Benjamin Shawley, Michael Enders
  • Laminated Ceramic RF Assembly
    Publication number: 20140159836
    Abstract: The present invention is directed to a stripline assembly that includes a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate. A second pre-fired ceramic substrate includes a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface. The circuit is disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. A conductive bonding layer is disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate.
    Type: Application
    Filed: March 14, 2013
    Publication date: June 12, 2014
    Applicant: ANAREN, INC.
    Inventors: Benton O'Neil, Adam Cook, Benjamin Shawley
  • Stacked Microstrip Circuit with Integrated Support and Shielding Structure
    Publication number: 20140159828
    Abstract: The present invention is directed to an assembly that includes at least one first microstrip network having at least one first transmission line disposed on a first surface of a first dielectric layer. The first dielectric layer includes a first ground plane disposed on a second surface of the dielectric layer. At least one second microstrip network includes at least one second transmission line disposed on a first surface of a second dielectric layer, the second dielectric layer including a second ground plane disposed on a second surface of the second dielectric layer. The at least one second microstrip network is inverted relative to the at least one first microstrip network. At least one integrated support and shielding (ISS) structure is disposed between the at least one second microstrip network and the at least one first microstrip network.
    Type: Application
    Filed: March 14, 2013
    Publication date: June 12, 2014
    Applicant: ANAREN. INC.
    Inventors: Benjamin Shawley, Michael Enders