Abstract: A method for swapping an optical system, such as a DUV mirror, of a projection exposure apparatus, comprises: a) raising the optical system along a centre axis of the optical system so that mount struts of the optical system pass out of contact with frame struts of a frame carrying the optical system; b) rotating the optical system about the centre axis so that the mount struts are arranged between the frame struts; c) lowering the optical system along the centre axis; and d) shifting the optical system perpendicularly to the centre axis so that the optical system is moved out of a housing.

Abstract: The present disclosure relates to a device for cleaning a surface in the interior of an optical system. The device includes a rod-shaped element. The rod-shaped element includes an imager configured to image contaminates on the surface, and a cleaner configured to remove contaminates from the surface. The device also includes a distance sensor that is configured to measure the distance between the surface and the end of the rod-shaped element. The device also includes a connection element configured to be secured at an opening of the optical system, and the connection element includes a guide element configured to guide the rod-shaped element.

Abstract: The disclosure relates to a projection exposure apparatus for semiconductor lithography which includes an actuator system to mechanically actuate a component of the projection exposure apparatus. The actuator system has at least one mechanism to reduce and/or dampen the heat input into the component that is due to heat arising during the operation of the actuator system.

Abstract: An optical system has an aperture device having a multiplicity of aperture elements for the delimitation of the cross section of a ray bundle running through the optical system. The aperture device has a first aperture element, which is pivotable about a first rotation axis between an engagement position in the beam path of the optical system and a neutral position outside the beam path of the optical system and has a first aperture opening delimited by a first aperture edge. The aperture device also has at least one second aperture element, which is pivotable about a second rotation axis between an engagement position in the beam path of the optical system and a neutral position outside the beam path of the optical system and has a second aperture opening delimited by a second aperture edge. The second aperture opening is smaller than the first aperture opening. The aperture elements pivoted into the engagement position form an effective aperture opening.

Abstract: An optical component includes at least one micro-opto-electro-mechanical system (MOEMS) with a front side and a rear side. The optical component also includes at least one printed circuit board arranged on the rear side of the at least one MOEMS. The at least one printed circuit board has lateral contacts. The at least one printed circuit board may be equipped with electronic parts and cooling elements. The at least one MOEMS projects laterally beyond the at least one printed circuit board.

Abstract: An optical component includes at least one micro-opto-electro-mechanical system (MOEMS) with a front side and a rear side. The optical component also includes at least one printed circuit board arranged on the rear side of the at least one MOEMS. The at least one printed circuit board has lateral contacts. The at least one printed circuit board may be equipped with electronic parts and cooling elements. The at least one MOEMS projects laterally beyond the at least one printed circuit board.

Abstract: The disclosure relates to a projection exposure apparatus for semiconductor lithography which includes an actuator system to mechanically actuate a component of the projection exposure apparatus. The actuator system has at least one mechanism to reduce and/or dampen the heat input into the component that is due to heat arising during the operation of the actuator system.

Abstract: The disclosure relates to a projection exposure apparatus for semiconductor lithography which includes an actuator system to mechanically actuate a component of the projection exposure apparatus. The actuator system has at least one mechanism to reduce and/or dampen the heat input into the component that is due to heat arising during the operation of the actuator system.

Abstract: Optical devices that have at least one optical element and a plurality of kinematic components are disclosed. The number m of the kinematic components of one type exceed the number n of degrees of freedom in which the optical element can be manipulated. At least one of the n degrees of freedom can be x-displacement, y-displacement, z-displacement or tilt.

Abstract: The disclosure relates to a projection exposure apparatus for semiconductor lithography which includes an actuator system to mechanically actuate a component of the projection exposure apparatus. The actuator system has at least one mechanism to reduce and/or dampen the heat input into the component that is due to heat arising during the operation of the actuator system.

Abstract: An optical system has an aperture device having a multiplicity of aperture elements for the delimitation of the cross section of a ray bundle running through the optical system. The aperture device has a first aperture element, which is pivotable about a first rotation axis between an engagement position in the beam path of the optical system and a neutral position outside the beam path of the optical system and has a first aperture opening delimited by a first aperture edge. The aperture device also has at least one second aperture element, which is pivotable about a second rotation axis between an engagement position in the beam path of the optical system and a neutral position outside the beam path of the optical system and has a second aperture opening delimited by a second aperture edge. The second aperture opening is smaller than the first aperture opening. The aperture elements pivoted into the engagement position form an effective aperture opening.

Abstract: A projection objective for a microlithography apparatus with improved imaging properties is provided. A manipulator for a projection objective is provided. A microlithography apparatus including a projection objective of this type and/or a manipulator of this type is provided. A method for improving the imaging properties of a projection objective is provided.

Abstract: Optical devices that have at least one optical element and a plurality of kinematic components are disclosed. The number m of the kinematic components of one type exceed the number n of degrees of freedom in which the optical element can be manipulated. At least one of the n degrees of freedom can be x-displacement, y-displacement, z-displacement or tilt.