Patents by Inventor Benjamin Slager

Benjamin Slager has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Advanced antiballistic materials
    Patent number: 7964261
    Abstract: A stack having at least one layer of tapes and at least one layer of multifilament yarn.
    Type: Grant
    Filed: October 7, 2008
    Date of Patent: June 21, 2011
    Assignee: Novameer B.V.
    Inventors: Jan Adolph Dam Backer, Benjamin Slager, Bart Clemens Kranz
  • PROCESS FOR PRODUCING HIGH STRENGTH POLYETHYLENE FILM
    Publication number: 20110028671
    Abstract: Process for producing high strength polyethylene films or tapes comprising the steps of: providing a quantity of disentangled polyethylene, applying a pressure of at least 20 bar to the quantity of disentangled polyethylene and a temperature between the ?-relaxation temperature and the melting temperature of the disentangled polyethylene Tm PE resulting in a block of disentangled polyethylene, skiving a film or tape off the block of disentangled polyethylene and, drawing said film or tape in a single or multi stage drawing step at a total draw ratio of at least 1:20.
    Type: Application
    Filed: April 21, 2009
    Publication date: February 3, 2011
    Applicant: NOVAMEER B.V.
    Inventors: Jan Adolph Dam Backer, Bart Clemens Kranz, Benjamin Slager
  • ADVANCED ANTIBALLISTIC MATERIALS
    Publication number: 20100247847
    Abstract: A stack is proposed comprising at least one layer of tapes and at least one layer of multifilament yarn.
    Type: Application
    Filed: October 7, 2008
    Publication date: September 30, 2010
    Applicant: NOVAMEER B.V.
    Inventors: Jan Adolph Dam Backer, Benjamin Slager, Bart Clemens Kranz
  • Method for encapsulating a chip on a carrier
    Patent number: 6399004
    Abstract: Method for encapsulating a chip (10) on a carrier (12) whereby the chip (10) is positioned on the carrier (12), a dam (16a, 16b) is formed on the carrier (12) around the chip (10), encapsulating material (18) is poured into the space within the dam (16a, 16b), and the obtained encapsulated structure is cured. In a first separate step on the carrier only the dam (16a, 16b) is formed from a thermohardening material at a relatively high temperature and is cured at least partly and in a succeeding second step the space within the dam is filled with the same thermohardening material at a relatively low temperature.
    Type: Grant
    Filed: October 1, 1999
    Date of Patent: June 4, 2002
    Assignee: Nedcard B.V.
    Inventor: Benjamin Slager