Abstract: A lens system for a camera objective has a plurality of optical lenses that are arranged one after another along an optical axis and are configured for imaging in the visually perceivable spectral range. At least a part of the optical lenses has two types of lens faces that intersect a beam path of the camera objective. At least three of said lens faces are provided with a first anti-reflective coating which has a larger reflectance in at least one partial region of the visible spectral range than a second anti-reflective coating of the remaining lens faces. In addition, a camera objective including the lens system and a method for producing a lens system are provided.

Abstract: A lens system for a camera objective has a plurality of optical lenses that are arranged one after another along an optical axis and are configured for imaging in the visually perceivable spectral range. At least a part of the optical lenses has two types of lens faces that intersect a beam path of the camera objective. At least three of said lens faces are provided with a first anti-reflective coating which has a larger reflectance in at least one partial region of the visible spectral range than a second anti-reflective coating of the remaining lens faces. In addition, a camera objective including the lens system and a method for producing a lens system are provided.

Abstract: A method of aligning a lens device includes: coupling an optical free-space beam that propagates along a first direction into an access port of an optoelectronic component, the first, a second, and a third direction being mutually perpendicular; positioning the lens device inside a free-space beam path, the lens device having an adjustment lens configured to focus radiation in only the second direction; moving the lens device along the second direction to align the adjustment lens with respect to the access port at an initial aligned position at which the optical free-space beam is one-dimensionally focused by the adjustment lens and at least a portion of a resulting one-dimensionally focused beam is input into the access port; and starting from the initial aligned position, moving the lens device in the second and/or third directions to position an optical element of the lens device in front of the access port.

Abstract: A method of aligning a lens device includes: coupling an optical free-space beam that propagates along a first direction into an access port of an optoelectronic component, the first, a second, and a third direction being mutually perpendicular; positioning the lens device inside a free-space beam path, the lens device having an adjustment lens configured to focus radiation in only the second direction; moving the lens device along the second direction to align the adjustment lens with respect to the access port at an initial aligned position at which the optical free-space beam is one-dimensionally focused by the adjustment lens and at least a portion of a resulting one-dimensionally focused beam is input into the access port; and starting from the initial aligned position, moving the lens device in the second and/or third directions to position an optical element of the lens device in front of the access port.

Abstract: An embodiment of the invention relates to an optical module comprising at least one optoelectronic component capable of generating or receiving radiation; at least one access port for receiving or emitting the radiation; at least one free-space beam path located between the access port and the optoelectronic component; at least one mirror located in said beam path; at least one attenuation unit located in said beam path; the attenuation unit having a reflecting surface section and an absorbing surface section; and, a control unit for adjusting the amount of radiation which is directed towards the absorbing surface section of the attenuation unit by controlling at least one or all of the following: the position of the mirror, the orientation of the mirror, the position of the attenuation unit and/or the orientation of the attenuation unit.

Abstract: An embodiment of the invention relates to an optical module comprising at least one optoelectronic component capable of generating or receiving radiation; at least one access port for receiving or emitting the radiation; at least one free-space beam path located between the access port and the optoelectronic component; at least one mirror located in said beam path; at least one attenuation unit located in said beam path; the attenuation unit having a reflecting surface section and an absorbing surface section; and, a control unit for adjusting the amount of radiation which is directed towards the absorbing surface section of the attenuation unit by controlling at least one or all of the following: the position of the mirror, the orientation of the mirror, the position of the attenuation unit and/or the orientation of the attenuation unit.

Abstract: An embodiment of the invention relates to an optical component (10, 300) for processing optical signals comprising a rhombic prism (20) having a first surface (SF1), a second surface (SF2) that is parallel to the first surface (SF1), a third surface (SF3) that is angled relative to the first and second surfaces (SF1, SF2) and connects the first and second surfaces (SF1, SF2), and a fourth surface (SF4) that is parallel to the third surface (SF3) and connects the first and second surfaces (SF1, SF2), wherein the third surface (SF3) is covered by a polarization dependent layer (PDL) capable of transmitting radiation having a first polarization and capable of reflecting radiation having a second polarization, said first and second polarizations being perpendicular to each other.

Abstract: A method of producing a device with a movable portion spaced apart from a support wafer comprises a step of providing the support wafer having a structured surface and a further step of providing a device wafer with a backing layer and a device layer disposed thereon. Further, the method comprises the step of generating a first planarization layer from a first starting material on the support wafer with a first method to fill in the structures of the structured surface of the support wafer, whereby a surface with a first degree of planarization is obtained. Further, the method comprises a step of generating a second planarization layer from a second starting material on the planarized surface of the support wafer with a second method to obtain a surface with a second degree of planarization, which is higher than the first degree of planarization, wherein the first and second planarization layers can be removed together.