Patents by Inventor Benjamin W. CAMPBELL

Benjamin W. CAMPBELL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11845943
    Abstract: Provided herein are materials and in planta methods for using haploid inducer lines containing a targeted endonuclease to generate transgenic or non-transgenic plants with targeted mutations and/or genomic modifications. Also provided herein.
    Type: Grant
    Filed: December 2, 2021
    Date of Patent: December 19, 2023
    Assignee: Regents of the University of Minnesota
    Inventors: Benjamin W. Campbell, Junqi Liu, Robert M. Stupar
  • Publication number: 20220186241
    Abstract: Provided herein are materials and in planta methods for using haploid inducer lines containing a targeted endonuclease to generate transgenic or non-transgenic plants with targeted mutations and/or genomic modifications. Also provided herein.
    Type: Application
    Filed: December 2, 2021
    Publication date: June 16, 2022
    Inventors: Benjamin W. Campbell, Junqi Liu, Robert M. Stupar
  • Patent number: 11193131
    Abstract: Provided herein are materials and in planta methods for using haploid inducer lines containing a targeted endonuclease to generate transgenic or non-transgenic plants with targeted mutations and/or genomic modifications.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: December 7, 2021
    Assignee: Regents of the University of Minnesota
    Inventors: Benjamin W. Campbell, Junqi Liu, Robert M. Stupar
  • Publication number: 20180245090
    Abstract: Provided herein are materials and in planta methods for using haploid inducer lines containing a targeted endonuclease to generate transgenic or non-transgenic plants with targeted mutations and/or genomic modifications.
    Type: Application
    Filed: June 30, 2016
    Publication date: August 30, 2018
    Inventors: Benjamin W. CAMPBELL, Junqi LIU, Robert M. STUPAR