Patents by Inventor Benjamin W. Carpenter

Benjamin W. Carpenter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12080978
    Abstract: An edge launch radio frequency (RF) signal connector includes ground contact tabs that have radially extending arms. The arms cover a gap between a substrate, such as a circuit board, and the connector to reduce the RF ground path between the RF reference ground and a signal pin supported by the connector. The arms extend radially inwardly from the protruding ground contact tabs toward a central support aperture that supports the signal pin. The arms and the ground contact tabs are formed integrally with the main connector body as one piece. The arms and the ground contact tabs may be planar in shape such that the arms and the ground contact tabs lie flush on the substrate when the connector is arranged over the edge of the substrate.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: September 3, 2024
    Assignee: Raytheon Company
    Inventors: Benjamin W. Carpenter, Ryan D. Dewitt, Michael R. Beylor
  • Publication number: 20230216256
    Abstract: An edge launch radio frequency (RF) signal connector includes ground contact tabs that have radially extending arms. The arms cover a gap between a substrate, such as a circuit board, and the connector to reduce the RF ground path between the RF reference ground and a signal pin supported by the connector. The arms extend radially inwardly from the protruding ground contact tabs toward a central support aperture that supports the signal pin. The arms and the ground contact tabs are formed integrally with the main connector body as one piece. The arms and the ground contact tabs may be planar in shape such that the arms and the ground contact tabs lie flush on the substrate when the connector is arranged over the edge of the substrate.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Inventors: Benjamin W. Carpenter, Ryan D. Dewitt, Michael R. Beylor