Abstract: A tensioning apparatus for pulling together respective ends of a previously severed high-tension cable and, thus, repairing and restoring tension upon a unified cable includes a base member defining a pair of guide channels spaced apart along a common longitudinal axis. The tensioning apparatus includes a pair of tensioning arms positioned in the pair of guide channels, respectively, that is slidably movable between a relaxed configuration displaced from one another and a tensioned configuration proximate one another. Each tensioning arm includes a gripper member configured to clamp onto the respective ends of the severed cable. Hydraulic or pneumatic power is operatively coupled to the pair of tensioning arms for selectively actuating movement of the pair of tensioning arms along the guide channels between the relaxed and tensioned configurations. In other words, the ends of the severed cable are pulled tightly toward one another and joined together under tension.

Abstract: A non-planar chemical vapour deposition polycrystalline diamond body has a dome body having an apex and an outer periphery. The dome body has an average radius of curvature in a range of 4 mm to 25 mm and a maximum linear dimension at the outer periphery of the dome body of no more than 26 mm. The average radius of curvature is no less than 0.6 times the maximum linear dimension at the outer periphery. A method of fabricating the non-planar diamond body is also disclosed.

Abstract: A non-planar chemical vapour deposition polycrystalline diamond body has a dome body having an apex and an outer periphery. The dome body has an average radius of curvature in a range of 4 mm to 25 mm and a maximum linear dimension at the outer periphery of the dome body of no more than 26 mm. The average radius of curvature is no less than 0.6 times the maximum linear dimension at the outer periphery. A method of fabricating the non-planar diamond body is also disclosed.

Abstract: A non-planar body (1) comprising a dome body (2) having an apex (3) and an outer periphery, the apex (3) located on a first plane (4) and the outer periphery located on a second plane (6) substantially parallel to the first plane (4). A peripheral body (5) extends at least partially around the outer periphery of the dome body (2), and at an angle (7) of less than 180° with respect to a tangent (8) relative to the dome body (2) at the outer periphery of the dome body (2), the angle (7) being measured at an outer surface of the dome body (2). Any of the dome body (2) and the peripheral body are formed from polycrystalline diamond.

Abstract: A poly crystalline chemical vapour deposited (CVD) diamond wafer comprising: —a diameter >40 mm; —a thickness >1.0 mm; —an absorption coefficient ?0.1 cm?1 at 10.6 ?m; and ?a micro feature density, especially in the form of “black spots”, meeting the following specification: —in a central area of the polycrystalline CVD diamond wafer from 0 to 20 mm radius there are no more than 100 micro features of a size between 0.002 and 0.008 mm2, no more than 50 micro features of a size between 0.008 and 0.018 mm2, no more than 25 microfeatures of a size between 0.018 and 0.05 mm2, and zero microfeatures of a size between 0.05 and 0.1 mm2, and ?in an outer region of the polycrystalline CVD diamond wafer from 20 to 40 mm radius there are no more than 200 microfeatures 2 of a size between 0.002 and 0.008 mm2, no more than 150 microfeatures of a size between 0.008 and 0.018 mm2, no more than 100 microfeatures of a size between 0.018 and 0.05 mm2, and zero microfeatures of a size between 0.05 and 0.1 mm2.

Abstract: A poly crystalline chemical vapour deposited (CVD) diamond wafer comprising: —a diameter >40 mm; —a thickness >1.0 mm; —an absorption coefficient ?0.1 cm?1 at 10.6 ?m; and ?a micro feature density, especially in the form of “black spots”, meeting the following specification: —in a central area of the polycrystalline CVD diamond wafer from 0 to 20 mm radius there are no more than 100 micro features of a size between 0.002 and 0.008 mm2, no more than 50 micro features of a size between 0.008 and 0.018 mm2, no more than 25 microfeatures of a size between 0.018 and 0.05 mm2, and zero microfeatures of a size between 0.05 and 0.1 mm2, and ?in an outer region of the polycrystalline CVD diamond wafer from 20 to 40 mm radius there are no more than 200 microfeatures 2 of a size between 0.002 and 0.008 mm2, no more than 150 microfeatures of a size between 0.008 and 0.018 mm2, no more than 100 microfeatures of a size between 0.018 and 0.05 mm2, and zero microfeatures of a size between 0.05 and 0.1 mm2.