Patents by Inventor Benjamin WIRTSCHAFTER

Benjamin WIRTSCHAFTER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11740090
    Abstract: An atom chip (Ach) for an ultra-cold atom sensor, the atom chip includes a first pair of waveguides, a second pair of waveguides, the projections of the guides along X and the guides along Y? in the plane XY forming, at their intersection, a first parallelogram with a centre O and having a first surface, a first conductive strip and a second conductive strip arranged such that their respective projection in the plane XY forms, at their intersection, a second parallelogram also with a centre O and having a second surface, the strips being designed to be flowed through by DC currents, an intersection between the first and the second surface being greater than or equal to 40% of the first surface.
    Type: Grant
    Filed: June 4, 2022
    Date of Patent: August 29, 2023
    Assignee: THALES
    Inventors: Benjamin Wirtschafter, Matthieu Dupont-Nivet
  • Publication number: 20230178262
    Abstract: An atom chip for an ultracold-atom sensor, the chip includes an XY-plane normal to a Z-axis, the atom chip comprising: first and second coplanar waveguides suitable for propagating microwaves at respective angular frequencies ?a and ?b, the waveguides being placed symmetrically on either side of the X-axis and being referred to as X-wise guides, first and second coplanar waveguides suitable for propagating microwaves at respective angular frequencies ??a and ??b, the waveguides being placed symmetrically on either side of an axis the projection of which in the XY-plane is along an axis Y? that is different from the X-axis and that is contained in the XY-plane, and being referred to as Y?-wise guides, the X-wise guides being electrically insulated from the Y?-wise guides, an intersection of the guides forming a parallelogram of center O defining an origin of the reference frame XYZ, at least a first conductive wire and a second conductive wire the respective projections of which in the XY-plane are secant at O
    Type: Application
    Filed: May 7, 2021
    Publication date: June 8, 2023
    Inventors: Matthieu DUPONT-NIVET, Benjamin WIRTSCHAFTER
  • Publication number: 20220397396
    Abstract: An atom chip (Ach) for an ultra-cold atom sensor, includes a measurement plane XY of the atom chip comprising: a plurality of first pairs of waveguides, a plurality of second pairs of waveguides, the projections in the plane XY of the first pair furthest from X and of the second pair furthest from Y? forming, at their intersection, a parallelogram with a centre O, a first conductive wire having a projection in the plane XY along X or Y? or a diagonal of the parallelogram, the first conductive wire being designed to be flowed through by a DC current, the first wire having a flaring so as to take the form of a surface whose projection in the plane XY incorporates the parallelogram and exhibits symmetry about the point O.
    Type: Application
    Filed: June 4, 2022
    Publication date: December 15, 2022
    Inventors: Benjamin WIRTSCHAFTER, Matthieu DUPONT-NIVET
  • Publication number: 20220397397
    Abstract: An atom chip (Ach) for an ultra-cold atom sensor, the atom chip includes a first pair of waveguides, a second pair of waveguides, the projections of the guides along X and the guides along Y? in the plane XY forming, at their intersection, a first parallelogram with a centre O and having a first surface, a first conductive strip and a second conductive strip arranged such that their respective projection in the plane XY forms, at their intersection, a second parallelogram also with a centre O and having a second surface, the strips being designed to be flowed through by DC currents, an intersection between the first and the second surface being greater than or equal to 40% of the first surface.
    Type: Application
    Filed: June 4, 2022
    Publication date: December 15, 2022
    Inventors: Benjamin WIRTSCHAFTER, Matthieu DUPONT-NIVET