Abstract: A method for vaporizing a liquid for subsequent thin film deposition on a substrate. The method comprises vaporizing a liquid which is disposed within a tubular porous metal body. The porous metal body comprises a first surface defining a first carrier gas flow path and a second surface defining a second carrier gas flow path in a substantially opposite direct to the first carrier flow path. Vapor is generated from the liquid and added to a carrier gas that passes sequentially in direct contact along the first and second surfaces of the porous metal body to form a gas/vapor mixture with the carrier gas first flowing along the first surface and then along the second surface thereby providing a gas/vapor mixture for thin film deposition.

Abstract: The present disclosure describes an apparatus for detecting particles in a gas by saturating the gas with vapor and causing the gas to flow through a chamber with walls that are at a temperature different than the temperature of the entering gas creating a gas turbulence within the chamber resulting in the gas becoming super-saturated with vapor and causing said super-saturated vapor to condense on said particles and form droplets, which are then detected and counted by an optical light-scattering detector.

Abstract: An apparatus and method for generating vapor from a liquid precursor for a thin film deposition on a substrate includes an inlet section in fluid communication with a downstream vaporization chamber section. The inlet section comprises a gas inlet for receiving gas from a gas source through a gas flow sensor and a gas flow control valve and a liquid inlet for receiving liquid from a liquid source through a liquid flow sensor and a liquid flow control valve. An electronic controller controls the gas and liquid flow control valves thereby controlling the rates of gas and liquid flow into the inlet section to generate vapor in the downstream vaporization chamber section for thin film deposition on the substrate.

Abstract: The present disclosure relates to an apparatus and a method for forming a droplet aerosol for vaporization and subsequent thin film deposition on a substrate. The apparatus includes a mechanism to control the rate of liquid flow through the apparatus, the mechanism including a piezoelectric actuator to adjust the rate of liquid flow and an atomizing mechanism drawing gas from a compressed gas source such that when the gas source conjoins with the liquid, the liquid is atomized to form droplets suspended in the gas thereby forming a droplet aerosol suitable for subsequent thin film deposition on a substrate. The method includes drawing a gas from a compressed gas source and drawing a liquid from a liquid source. The liquid and gas are conjoined in either a coaxial flow relationship or a radial flow relationship or an angular relationship between radial and coaxial flow wherein the gas engages the liquid to form droplets suitable for vaporization and subsequent thin film deposition on a substrate.

Abstract: Methods for recovery of precursor vapor from a gas and precursor vapor mixture used in a deposition process. The gas and precursor vapor mixture is passed through a multitude of heat transfer surfaces in a heat conducting housing causing the precursor vapor to condense. The precursor vapor in liquid form is then collected after condensation.

Abstract: Methods and apparatus for recovery of precursor vapor from a gas and precursor vapor mixture used in a deposition process. The gas and precursor vapor mixture is passed through a multitude of heat transfer surfaces in a heat conducting housing causing the precursor vapor to condense. The precursor vapor in liquid form is then collected after condensation.

Abstract: The present disclosure relates to an apparatus and a method for vaporizing a liquid to form vapor preferably in a gas stream. The apparatus includes a composite metal structure, the structure comprising a plurality of passageways for providing heat to vaporize the liquid in the gas stream to form a gas/vapor mixture. A non-corrosive interface lies between the metal structure and the gas/vapor mixture, the interface being chemically inert to the gas/vapor mixture and the structure permitting heat to be conducted rapidly therethrough to vaporize the liquid. The apparatus further includes an inlet for the gas and an inlet for the liquid to be vaporized to flow into the plurality of passageways and an exit through which the gas/vapor mixture exits the apparatus.

Abstract: The present disclosure describes an apparatus for detecting particles in a gas by saturating the gas with vapor and causing the gas to flow through a chamber with walls that are at a temperature different than the temperature of the entering gas creating a gas turbulence within the chamber resulting in the gas becoming super-saturated with vapor and causing said super-saturated vapor to condense on said particles and form droplets, which are then detected and counted by an optical light-scattering detector.

Abstract: An apparatus for controlling liquid flow wherein the apparatus comprises an orifice and an adjacent flexible diaphragm separated from each other by a gap through which a liquid flows. The diaphragm is sufficiently flexible to vary the gap thereby controlling the rate of liquid flowing through the orifice or to provide a positive liquid shutoff of liquid flowing through the orifice. A method for controlling liquid flow through the apparatus comprises flexing said diaphragm to vary a size of the gap to control the rate of liquid flowing through the orifice or to provide a positive liquid shutoff of liquid from flowing through the orifice.

Abstract: A method for atomizing a precursor liquid for vapor generation and thin film deposition on a substrate. The precursor liquid is atomized by a carrier gas to form a droplet aerosol composed of small precursor liquid droplets suspended in the carrier gas. The droplet aerosol is then heated to form vapor, producing a gas/vapor mixture that can be introduced into a deposition chamber to form thin films on a substrate. The liquid is introduced into the atomizing apparatus in such a manner as to avoid excessive heating that can occur or lead to the formation of undesirable by-products due to material degradation as result of thermal decomposition. The method is particularly suited for vaporizing high molecular weight substances with a low vapor pressure that requires a high vaporization temperature for the liquid to vaporize. The method can also be used to vaporize solid precursors dissolved in a solvent for vaporization.

Abstract: The present disclosure relates to an apparatus and a method for forming a droplet aerosol for vaporization and subsequent thin film deposition on a substrate. The apparatus includes a mechanism to control the rate of liquid flow through the apparatus, the mechanism including a piezoelectric actuator to adjust the rate of liquid flow and an atomizing mechanism drawing gas from a compressed gas source such that when the gas source conjoins with the liquid, the liquid is atomized to form droplets suspended in the gas thereby forming a droplet aerosol suitable for subsequent thin film deposition on a substrate. The method includes drawing a gas from a compressed gas source and drawing a liquid from a liquid source. The liquid and gas are conjoined in either a coaxial flow relationship or a radial flow relationship or an angular relationship between radial and coaxial flow wherein the gas engages the liquid to form droplets suitable for vaporization and subsequent thin film deposition on a substrate.

Abstract: A gas filtration apparatus and method comprises a housing with an inlet for gas to enter and an outlet for the gas to exit. The housing contains a filter comprised of sintered metal fibers having an active filtration area through which the gas flows to remove suspended particles from the gas. The filter is substantially uniform in thickness and porosity through the active filtration area. The filter media being sealed to a metal structure in the housing with the metal structure having an opening to permit gas to flow through. A method of making a vapor/gas mixture includes the steps of producing a vapor in a gas to form the vapor/gas mixture passing the vapor/gas mixture through an opening in a housing containing a filter comprised of sintered metal fibers through which the vapor/gas mixture flows.

Abstract: A method for detecting particles in a gas by saturating the gas with vapor and causing the gas to flow through a chamber with walls that are at a temperature different than the temperature of the entering gas creating a gas turbulence within the chamber resulting in the gas becoming super-saturated with vapor and causing said super-saturated vapor to condense on said particles and form droplets, which are then detected and counted by an optical light-scattering detector.

Abstract: A method for atomizing a precursor liquid for vapor generation and thin film deposition on a substrate. The precursor liquid is atomized by a carrier gas to form a droplet aerosol comprised of small precursor liquid droplets suspended in the carrier gas. The droplet aerosol is then heated to form vapor, producing a gas/vapor mixture that can be introduced into a deposition chamber to form thin films on a substrate. The liquid is introduced into the atomizing apparatus in such a manner as to avoid excessive heating that can occur or lead to the formation of undesirable by-products due to material degradation as result of thermal decomposition. The method is particularly suited for vaporizing high molecular weight substances with a low vapor pressure that requires a high vaporization temperature for the liquid to vaporize. The method can also be used to vaporize solid precursors dissolved in a solvent for vaporization.

Abstract: An apparatus for atomizing a precursor liquid for vapor generation and thin film deposition on a substrate. The precursor liquid is atomized by a carrier gas to form a droplet aerosol composed of small precursor liquid droplets suspended in the carrier gas. The droplet aerosol is then heated to form vapor, producing a gas/vapor mixture that can be introduced into a deposition chamber to form thin films on a substrate. The liquid is introduced into the atomizing apparatus in such a manner as to avoid excessive heating that can occur or lead to the formation of undesirable by-products due to material degradation as result of thermal decomposition. The apparatus is particularly suited for vaporizing high molecular weight substances with a low vapor pressure that requires a high vaporization temperature for the liquid to vaporize. The apparatus can also be used to vaporize solid precursors dissolved in a solvent for vaporization.

Abstract: The present disclosure describes a method and apparatus for detecting particles in a gas by saturating the gas with vapor and causing the gas to flow through a chamber with walls that are at a temperature different than the temperature of the entering gas creating a gas turbulence within the chamber resulting in the gas becoming super-saturated with vapor and causing said super-saturated vapor to condense on said particles and form droplets, which are then detected and counted by an optical light-scattering detector.

Abstract: A method for establishing a calibrating standard for wafer inspection includes depositing solid ionized particles of a known size range with an aerosol onto a wafer. The method also includes depositing particles onto a wafer in a deposition chamber by using an aerosol stream and the solid particles suspended in a gas; ionizing the aerosol stream with a negative or positive charge polarity or both by passing the aerosol stream through a non-radioactive ionizer to produce charged particles and supplying such aerosol stream to the deposition chamber.

Abstract: An apparatus for atomizing a precursor liquid for vapor generation and thin film deposition on a substrate. The precursor liquid is atomized by a carrier gas to form a droplet aerosol comprised of small precursor liquid droplets suspended in the carrier gas. The droplet aerosol is then heated to form vapor, producing a gas/vapor mixture that can be introduced into a deposition chamber to form thin films on a substrate. The liquid is introduced into the atomizing apparatus in such a manner as to avoid excessive heating that can occur or lead to the formation of undesirable by-products due to material degradation as result of thermal decomposition. The apparatus is particularly suited for vaporizing high molecular weight substances with a low vapor pressure that requires a high vaporization temperature for the liquid to vaporize. The apparatus can also be used to vaporize solid precursors dissolved in a solvent for vaporization.

Abstract: An apparatus for atomizing a precursor liquid for vapor generation and thin film deposition on a substrate. The precursor liquid is atomized by a carrier gas to form a droplet aerosol composed of small precursor liquid droplets suspended in the carrier gas. The droplet aerosol is then heated to form vapor, producing a gas/vapor mixture that can be introduced into a deposition chamber to form thin films on a substrate. The liquid is introduced into the atomizing apparatus in such a manner as to avoid excessive heating that can occur or lead to the formation of undesirable by-products due to material degradation as result of thermal decomposition. The apparatus is particularly suited for vaporizing high molecular weight substances with a low vapor pressure that requires a high vaporization temperature for the liquid to vaporize. The apparatus can also be used to vaporize solid precursors dissolved in a solvent for vaporization.

Abstract: An apparatus and method for generating vapor from a liquid precursor for a thin film deposition on a substrate includes an inlet section in fluid communication with a downstream vaporization chamber section. The inlet section comprises a gas inlet for receiving gas from a gas source through a gas flow sensor and a gas flow control valve and a liquid inlet for receiving liquid from a liquid source through a liquid flow sensor and a liquid flow control valve. An electronic controller controls the gas and liquid flow control valves thereby controlling the rates of gas and liquid flow into the inlet section to generate vapor in the downstream vaporization chamber section for thin film deposition on the substrate.