Abstract: A thermal foot pad assembly includes a foot pad that is insertable into an article of footwear and the foot pad is positioned beneath a user's foot when the user wears the article of footwear. A plurality of pouches is each integrated into the foot pad and each of the plurality of pouches is filled with a thermally conductive gel to cool the user's foot when the user steps on the plurality of pouches. A toe pad is attached to the foot pad and the toe pad is strategically positioned on the foot pad. The toe pad is positioned beneath the user's toes when the user wears the article of footwear. Furthermore, the toe pad is comprised of a thermally conductive material to absorb heat from the user's toes thereby cooling the user's toes.