Patents by Inventor Benjamin ZASS

Benjamin ZASS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12696425
    Abstract: The specification provides arrangements including an electronic controller unit, ECU, comprising a heatsink, a first printed circuit board, PCB; and a second printed circuit board, PCB. A plurality of components are provided located on said PCBs. The heatsink is arranged between the first and second PCBs and is thermally coupled to the components to provide cooling. The heatsink further comprises an aperture extending through a body of the heatsink. The first PCB is directly connected to the second PCB by a board-to-board, B2B, connector configured to electrically and/or communicatively connect the PCBs located above and below the heatsink. The specification also provides arrangements of a heatsink provided for use within an ECU.
    Type: Grant
    Filed: June 14, 2023
    Date of Patent: July 28, 2026
    Assignee: Aptiv Technologies AG
    Inventors: Peter Reinhold, Falk Rademacher, Jochen Suck, Benjamin Zass
  • Patent number: 12658911
    Abstract: Disclosed is an electrical power switching circuit. The electrical power switch circuit includes a first semiconductor switch having a first control input and a second semiconductor switch having a second control input. The first semiconductor switch and the second semiconductor switch are connected in series. The electrical power switch circuit includes a comparator configured to compare a first voltage to a second voltage and to output a first electrical signal if the first voltage exceeds the second voltage by a first predetermined threshold and to output a second electrical signal if the second voltage exceeds the first voltage by a second predetermined threshold. The electrical power switch circuit includes a combiner configured to combine the first signal and the second signal and to feed a combined signal to the first and second control inputs of the first and second semiconductor switches.
    Type: Grant
    Filed: January 23, 2024
    Date of Patent: June 16, 2026
    Assignee: Aptiv Technologies AG
    Inventors: Emmanuel Boudoux, Thorsten Rosenthal, Benjamin Zass
  • Publication number: 20240250680
    Abstract: Disclosed is an electrical power switching circuit. The electrical power switch circuit includes a first semiconductor switch having a first control input and a second semiconductor switch having a second control input. The first semiconductor switch and the second semiconductor switch are connected in series. The electrical power switch circuit includes a comparator configured to compare a first voltage to a second voltage and to output a first electrical signal if the first voltage exceeds the second voltage by a first predetermined threshold and to output a second electrical signal if the second voltage exceeds the first voltage by a second predetermined threshold. The electrical power switch circuit includes a combiner configured to combine the first signal and the second signal and to feed a combined signal to the first and second control inputs of the first and second semiconductor switches.
    Type: Application
    Filed: January 23, 2024
    Publication date: July 25, 2024
    Inventors: Emmanuel Boudoux, Thorsten Rosenthal, Benjamin Zass
  • Publication number: 20230413486
    Abstract: The specification provides arrangements including an electronic controller unit, ECU, comprising a heatsink, a first printed circuit board, PCB; and a second printed circuit board, PCB. A plurality of components are provided located on said PCBs. The heatsink is arranged between the first and second PCBs and is thermally coupled to the components to provide cooling. The heatsink further comprises an aperture extending through a body of the heatsink. The first PCB is directly connected to the second PCB by a board-to-board, B2B, connector configured to electrically and/or communicatively connect the PCBs located above and below the heatsink. The specification also provides arrangements of a heatsink provided for use within an ECU.
    Type: Application
    Filed: June 14, 2023
    Publication date: December 21, 2023
    Inventors: Peter REINHOLD, Falk RADEMACHER, Jochen SUCK, Benjamin ZASS