Patents by Inventor Bennett Dean Langsdorf

Bennett Dean Langsdorf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Graded vias for LED chip P- and N- contacts
    Patent number: 9412907
    Abstract: The present disclosure provides various embodiments of light emitting chips and packages with improved current spreading structures, such as non-uniform via structures or varied via structures. In some embodiments, these structures may be used to regulate current flow and current crowding in order to improve emitter efficiency and uniformity. Some embodiments of this disclosure may also refer to contact pad placement to improve current flow. In some embodiments of non-uniform via structures, the size of the vias may vary, whereas in other embodiments, the shape or spacing between the vias may vary.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: August 9, 2016
    Assignee: CREE, INC.
    Inventors: Thomas Place, Bennett Dean Langsdorf