Patents by Inventor Bennett J. Reding

Bennett J. Reding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4772936
    Abstract: In a packaged electronic circuit, the circuit or circuits is soldered to a flexible tape, then tested and, any defective elements replaced. The tape is then soldered to a package. Different tapes may be used to change the pin-out of a chip; or to accomodate two sets of chips having different contact arrays.
    Type: Grant
    Filed: April 7, 1987
    Date of Patent: September 20, 1988
    Assignee: United Technologies Corporation
    Inventors: Bennett J. Reding, Chandler H. McIver