Abstract: An integrated circuit package (50) is provided which comprises a substrate (20), an integrated circuit (12) mounted on the substrate, and a compressive, thermally conductive interposer (52) mounted on the integrated circuit.

Abstract: Integrated circuit packaging with improved thermal transmission from the integrated circuit heat source to the exterior of the packaging. Improved packaging employs a compressive interposer which allows for greater manufacturability of the packaged integrated circuit parts. Additionally different shaped compressive interposers are described.

Abstract: A semiconductor device has a die (10) overlying and electrically connected to a support structure (11), such as a substrate or a lead frame, via a plurality of interconnects. Aggressor interconnects (32, 38) are noise sources to victim interconnects (29, 59) carrying sensitive signals. An arrangement of shield interconnects (51-58) surround the victim interconnect (29, 59) in a cage-like structure to significantly block noise from the aggressor interconnect. In one form the shield interconnects are ground or power supply and the victim interconnect may be, for example, a clock signal or an RF signal. The number of shield interconnects and the number of protected victim interconnects varies depending upon design requirements. Either wire bonding or other interconnect technology (e.g. bump) is applicable.