Patents by Inventor Benny David

Benny David has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fiber reinforced thermoplastic sheets with surface coverings
    Publication number: 20050215698
    Abstract: A composite sheet material that includes at least one porous core layer including a thermoplastic material and from about 20 weight percent to about 80 weight percent fibers based on a total weight of the porous core layer, and at least one skin covering a surface of the core layer. The skin includes at least one of a thermoplastic film, a fiber based scrim, a non-woven fabric, and a woven fabric.
    Type: Application
    Filed: March 26, 2004
    Publication date: September 29, 2005
    Inventors: Venkatkrishna Raghavendran, Daniel Woodman, Erich Teutsch, Ralph Buoniconti, Scott Davis, Paul Bristow, Minquan Cheng, Daniel Sowle, Benny David
  • Preparation process and properties of styrene butadiene random copolymer/poly(arylene ether) compositions
    Patent number: 6448327
    Abstract: An elastomer-thermoplastic composition comprising styrene butadiene random copolymer and poly(arylene ether) resin and methods of making the composition are disclosed.
    Type: Grant
    Filed: August 23, 2000
    Date of Patent: September 10, 2002
    Assignee: General Electric Company
    Inventors: Adrianus J. F. M. Braat, Benny David, Hua Guo, Juraj Liska, Herb Chao, Kenneth P. Zarnoch
  • Thermosetting resins and laminates
    Patent number: 6306963
    Abstract: Thermosetting polymers and the electrical laminates made therefrom are disclosed. The laminate comprises a cross-linked product of: a) one or more ethylenically unsaturated aromatic monomers, with fire retardation being optionally contributed by one halogenated monomer, b) a vinyl-terminated polybutadiene or butadiene-styrene copolymer containing either a urethane or an ester group, and c) a chemically modified polyphenylene ether resin, preferably low molecular weight chemically modified polyphenylene ether resin. It has been discovered that an unexpected combination of thermal, electrical, and mechanical properties are obtained from the composition recited herein. Therefore, the composition is ideally suited as a matrix polymer for electrical substrate applications.
    Type: Grant
    Filed: September 7, 2000
    Date of Patent: October 23, 2001
    Assignees: General Electric Co., GIL Technology
    Inventors: Scott A. Lane, Timothy W. Austill, Donald C. Rollen, Herbert Shin-I Chao, Kenneth P. Zarnoch, Hua Guo, David Parrillo, David Peter Reis, Narsi Devanathan, Benny David