Patents by Inventor Benny Joe Ledford, JR.

Benny Joe Ledford, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11608221
    Abstract: Shipping systems for temperature-sensitive materials and methods of making and using same. In one embodiment, the shipping system includes a cooler base and a lid. The base includes an inner portion and an outer portion. The inner portion includes a thermal insulation unit including a bottom wall and four side walls. A thermally-conductive member is positioned on the bottom wall. A polymeric bag encapsulates the thermally-conductive member and some of the thermal insulation unit. The outer portion includes thermally-insulating material and defines an opening. The inner portion is permanently bonded to the outer portion, with cavities defined therebetween. A product box is placed in the inner portion directly over the polymeric bag and the underlying thermally-conductive member. First temperature-control members are disposed within the inner portion, with at least one temperature-control member directly over the polymeric bag and the underlying thermally-conductive member.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: March 21, 2023
    Assignee: COLD CHAIN TECHNOLOGIES, LLC
    Inventors: Tzeho Lee, Benny Joe Ledford, Jr., Brian Paul Skocypec, Joseph F. Consiglio
  • Publication number: 20220281671
    Abstract: Shipping systems for temperature-sensitive materials and methods of making and using same. In one embodiment, the shipping system includes a cooler base and a lid. The base includes an inner portion and an outer portion. The inner portion includes a thermal insulation unit including a bottom wall and four side walls. A thermally-conductive member is positioned on the bottom wall. A polymeric bag encapsulates the thermally-conductive member and some of the thermal insulation unit. The outer portion includes thermally-insulating material and defines an opening. The inner portion is permanently bonded to the outer portion, with cavities defined therebetween. A product box is placed in the inner portion directly over the polymeric bag and the underlying thermally-conductive member. First temperature-control members are disposed within the inner portion, with at least one temperature-control member directly over the polymeric bag and the underlying thermally-conductive member.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 8, 2022
    Inventors: TzeHo Lee, Benny Joe Ledford, JR., Brian Paul Skocypec, Joseph F. Consiglio
  • Publication number: 20200002075
    Abstract: Shipping systems for temperature-sensitive materials and methods of making and using same. In one embodiment, the shipping system includes a cooler base and a lid. The base includes an inner portion and an outer portion. The inner portion includes a thermal insulation unit including a bottom wall and four side walls. A thermally-conductive member is positioned on the bottom wall. A polymeric bag encapsulates the thermally-conductive member and some of the thermal insulation unit. The outer portion includes thermally-insulating material and defines an opening. The inner portion is permanently bonded to the outer portion, with cavities defined therebetween. A product box is placed in the inner portion directly over the polymeric bag and the underlying thermally-conductive member. First temperature-control members are disposed within the inner portion, with at least one temperature-control member directly over the polymeric bag and the underlying thermally-conductive member.
    Type: Application
    Filed: June 14, 2019
    Publication date: January 2, 2020
    Inventors: TzeHo Lee, Benny Joe Ledford, JR., Brian Paul Skocypec, Joseph F. Consiglio