Abstract: Air filter systems, filter bag assemblies, filter bags and corresponding methods are described herein. Air filter systems, filter bag assemblies, filter bags and corresponding methods are described herein. The filter bag assemblies include a flange assembly, a cage attached to the flange assembly, and a filter bag installed over the cage with an opening at the flange assembly. When installed in the dirty air chamber of the air filter system, a seal between the flange assembly and the tubesheet defining the dirty air chamber is provided by applying a seal force on the end of the filter bag assembly located proximate the access panel on the side of the dirty air chamber opposite the tubesheet. That seal force is transmitted to the flange assembly through the cage. The tubular filter bags may be in the form of triangular bags and/or may include bag support connectors at the closed end of the bag.

Abstract: This disclosure suggests microelectronic substrates with thermally conductive pathways. In one implementation, such a substrate includes a body and a thermally conductive member. The Body has a first surface that includes a microelectronic component mounting site, a second surface separated from the first surface by a thickness, and an opening extending through at least a portion of the thickness. The opening is outwardly open at one or both of the surfaces and has a first portion having a first transverse dimension and a second portion having a larger second transverse dimension. The thermally conductive member includes a first thickness, which is received in the first portion of the opening, and a second thickness, which is received in the second portion of the opening. A transverse dimension of the second thickness of the thermally conductive member is greater than the first transverse dimension of the opening.