Abstract: An integrated circuit (IC) is provided. The IC includes a molding compound, a plurality of pins, an exposed pad, a die surrounded by the molding compound, an adhesive material, and a plurality of bonding wires. The pins are disposed on at least one edge of the molding compound and separated from each other. The adhesive material is disposed between the die and the exposed pad and surrounded by the molding compound. The exposed pad is electrically connected to the die through one of the bonding wires, and the pins are electrically connected to the die through the remaining bonding wires. The die is configured to detect whether a chassis intrusion event is present in response to a signal from the exposed pad.

Abstract: An embodiment of an IC is provided. The IC includes a memory, a controller, an intrusion detector and a memory clear circuit. The memory is configured to store sensitive data. The controller is configured to access the memory. The intrusion detector is configured to detect whether an intrusion event is present in response to an input signal. The memory clear circuit is configured to clear the sensitive data of the memory when the intrusion detector detects the intrusion event.

Abstract: Methods, apparatus, systems and articles of manufacture for a blister package are disclosed. An example blister package includes a cavity and a lid having both an open position to provide access to the cavity and a closed position to restrict access to the cavity. The blister package also includes a sensing circuit disposed at a first location on the blister package. The sensing circuit detects when the lid on the cavity is in the open position, exhibits a first output state when the lid on the cavity is in the open position. The blister package also includes a processor disposed at a second location on the blister package. The processor is in communication with the sensing circuit and generates a signal indicating the cavity has been accessed when the sensing circuit exhibits the first output state.