Patents by Inventor Benoît Filion

Benoît Filion has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Managing trench depth in integrated systems
    Patent number: 11227790
    Abstract: One or more photonic structures are formed within one or more layers over a surface of a substrate, and multiple trenches are formed through the one or more layers housing devices coupled to one or more of the photonic structures. The trenches may include: a first trench that has a bottom surface within the substrate that has a first surface topology characterized by a first surface roughness at a first depth within the substrate relative to the surface of the substrate, and a second trench that has a bottom surface within the substrate that has a second surface topology characterized by a second surface roughness at a second depth within the substrate relative to the surface of the substrate. The first surface roughness may be greater than the second surface roughness, and the second depth may be greater than the first depth.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: January 18, 2022
    Assignee: Ciena Corporation
    Inventors: Benoît Filion, Charles Baudot, François Pelletier, Christine Latrasse