Abstract: A method of forming an electrically conductive contact on an insulated substrate such as a printed circuit board includes the step of defining a contact area on the substrate and applying a copper buss on the substrate so that it extends beyond the marginal edges of the contact area. A thin layer of soldermask is then applied to cover the upper surface of the copper buss outside of the contact area and to cover areas of the substrate not covered by the copper buss. Thereafter, a Thick Film Polymer (TFP) conductive paste is applied over the exposed portions of the copper buss and over a small portion of the soldermask so that the copper buss is covered completely.