Abstract: A vacuum pump including a pump main unit and a control unit is disclosed. The control unit includes a substrate having electronic elements mounted thereon and terminal pins soldered to the substrate at a first end edge of the substrate. The substrate is mounted to a plate via an attachment near a second end edge opposing the first end edge and the plate is mounted to the pump main unit. The terminal pins extend through the plate. Upon linear thermal expansion of the terminal pins, by reason of the location of the terminal pins near the first end edge and the attachment near the second end edge, stresses in the soldered pin connections are reduced. A molding material having a Shore hardness of less than 50, is molded around the electronic elements on the substrate in one embodiment.

Abstract: A vacuum pump having substrates which can be wired together easily and cooled easily. A substrate unit structure is formed by covering the opening of the casing of the pump main unit with a plate functioning also as the casing of the control unit. Pins of a terminal fixed while penetrating the plate are soldered directly to an active magnetic bearing (AMB) control substrate and an aerial connection substrate in order to integrate these components. The casing and sealing structures can be of simple construction. A drip-proof structure can be made with the terminal at low cost without using expensive drip-proof connectors. Further, by cooling the plate, electronic components mounted respectively on the AMB control substrate in a vacuum atmosphere and the aerial connection substrate in an air atmosphere can be cooled simultaneously.

Abstract: To be provided is a vacuum pump reducing the influence of thermal expansion of connector pins to prevent cracks in soldered parts while preventing damage to electronic elements. Pins 207 linearly expand with the heat accumulated in a bottom space 301. The bottom space 301 is heated quite easily since it is in a vacuum environment. A screw 235A is arranged near the left edge of an AMB control substrate 209. Since no screw is arranged on the right of the screw 235A, the AMB control substrate 209 is released toward the right. When the pins 207 expand with heat, the AMB control substrate 209 bends by an angle ?2 from the screw 235A as a fulcrum, but this bend angle is gradual, which means that the possibility of causing cracks in solder connection parts between the AMB control substrate 209 and the pins 207 is extremely small. Since deforming pressure of the AMB control substrate 209 is reduced, influence on the electronic elements can be reduced correspondingly.

Abstract: To be provided is a vacuum pump having substrates which can be wired together easily and cooled easily. A substrate unit structure is formed by covering the opening of the casing of the pump main unit 100 with the plate 201 functioning also as the casing of the control unit 200. Pins 207 of a terminal 210 fixed while penetrating the plate 201 are soldered directly to an AMB control substrate 209 and an aerial connection substrate 211 in order to integrate these components. Therefore, the casing and sealing structures can be made simple. Accordingly, a drip-proof structure can be made with the terminal 210 at low cost without using expensive drip-proof connectors 1 and 3. Further, by cooling the plate 201, electronic components mounted respectively on the AMB control substrate 209 in a vacuum atmosphere and the aerial connection substrate 211 in an air atmosphere can be cooled simultaneously.