Abstract: A contact-based microdispensing tool for delivering extremely minute globules of epoxy material to repaired sites on high circuit density modules. The tool includes a solid probe integrally mounted in a contact sensor assembly incorporating an air-levitated core of a linear voltage differential transducer. The levitated core and the probe connected thereto are supported in neutral equilibrium by an air bearing assembly. As the assembly probe is brought into contact with one of the sites, the globule flows upon the site, the equilibrium is disturbed and a signal is produced by the transducer to halt movement of the probe relative to the site.

Abstract: An automated wire bonding tool for interconnecting circuit pads on microelectronic circuit devices and substrates. A single application of the bonding tool spans both bond sites with the wire being held under the bond tool and gripped at both ends while bonding the wire to both bond sites simultaneously and with high placement accuracy.