Patents by Inventor Benson Tu

Benson Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGES WITH A SHORTEST DISTANCE BETWEEN PACKAGE CONNECTORS AND A SEATING PLANE OF AT LEAST 6 MILS
    Publication number: 20240244761
    Abstract: An integrated circuit package with a package connector and at least three bottom-most points of the package that define a seating plane, wherein the shortest distance between the seating plane and the package connector solder surface is at least 6 mils (0.152 mm). A printed circuit board comprising a pad; an integrated circuit package comprising a package connector and at least three bottom-most points of the package in contact with the printed circuit board; and a solder column having a height at least 6 mils (0.152 mm) electrically and mechanically connecting the pad to the package connector. Methods for controlling solder column height are disclosed.
    Type: Application
    Filed: May 11, 2023
    Publication date: July 18, 2024
    Applicant: Microchip Technology Incorporated
    Inventors: Zhiyang Wang, Bianca Kwok, Benson Tu, Adrian Ocampo
  • Glove
    Patent number: D824637
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: August 7, 2018
    Inventors: Willy Chen, Jeff Lu, Benson Tu