Patents by Inventor Bensong Pi

Bensong Pi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bulk Acoustic Wave Resonance Assembly and Method for Manufacturing Same
    Publication number: 20250096773
    Abstract: The present application discloses a bulk acoustic wave resonance assembly and a method for manufacturing the same. The bulk acoustic wave resonance assembly of the present application includes a substrate, a first resonance assembly and a second resonance assembly which are arranged on the substrate; an interconnection region is formed between the first resonance assembly and the second resonance assembly; the first resonance assembly includes a first bottom electrode, a first piezoelectric layer, and a first top electrode which are arranged on the substrate in sequence; the second resonance assembly includes a second bottom electrode, a second piezoelectric layer, and a second top electrode which are arranged on the substrate in sequence; the first bottom electrode and the second top electrode are connected to each other in the interconnection region; and the second bottom electrode and the first top electrode are connected to each other in the interconnection region.
    Type: Application
    Filed: May 13, 2024
    Publication date: March 20, 2025
    Inventors: Jinhao DAI, Kunli ZHAO, Bensong Pi, Humberto Campanella, Hexin TENG, Taixi LI, Yaping ZHOU, Chao ZHAO, Xiaoping WANG, Jian WANG, Bowoon SOON, Chengliang SUN