Patents by Inventor Benwei LIN

Benwei LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation apparatus, circuit module, electronic device, and circuit module assembly method
    Patent number: 12660076
    Abstract: In a dissipation apparatus, a support is mounted to a circuit board, and an assembly opening on a bearing portion in the support is configured to accommodate a heat source on the circuit board. A heat sink is disposed on the bearing portion of the support, and a heat conducting surface of the heat sink can penetrate the assembly opening, to be attached to the heat conducting surface of the heat source. A peak-valley structure in an elastic component is disposed on a mounting surface of the heat sink as a force-applying portion, and two ends of the elastic component exceed an edge of the heat sink and are mounted to the support as mounting portions. At least one elastic component can provide, to the heat sink by using the peak-valley structure, pressure to tightly attach the heat sink to the heat source.
    Type: Grant
    Filed: December 20, 2023
    Date of Patent: June 16, 2026
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Wei Chen, Weice Ma, Benwei Lin, Xiaoyuan Ying
  • HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD
    Publication number: 20240121881
    Abstract: A heat dissipation apparatus is disclosed. In the dissipation apparatus, a support is mounted to a circuit board, and an assembly opening on a bearing portion in the support is configured to accommodate a heat source on the circuit board. A heat sink is disposed on the bearing portion of the support, and a heat conducting surface of the heat sink can penetrate the assembly opening, to be attached to the heat conducting surface of the heat source. A peak-valley structure in an elastic component is disposed on a mounting surface of the heat sink as a force-applying portion, and two ends of the elastic component exceed an edge of the heat sink and are mounted to the support as mounting portions. At least one elastic component can provide, to the heat sink by using the peak-valley structure, pressure to tightly attach the heat sink to the heat source.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Inventors: Wei CHEN, Weice MA, Benwei LIN, Xiaoyuan YING