Patents by Inventor Benxian PENG

Benxian PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230314377
    Abstract: The present invention discloses a real-time ultrasonic stimulation electric signal recording chip and a preparation method thereof, where the preparation method includes the following steps: S1 manufacturing an interdigital electrode on a piezoelectric substrate to obtain a surface acoustic wave chip, and manufacturing a recording electrode and an electrode lead; S2, manufacturing an insulation protection layer on the chip obtained in the S1, and processing the insulation protection layer to form the recording electrode, so as to obtain a chip combining the interdigital electrode and the recording electrode; S3, preparing a PDMS cavity; and S4, bonding the PDMS cavity prepared in the S3 and the chip obtained in the S2. In the present invention, combining the interdigital electrode generating a surface acoustic wave ultrasound with a multi-channel recording electrode, such that real-time recording of a multi-channel electric signal under ultrasonic stimulation is achieved.
    Type: Application
    Filed: June 9, 2023
    Publication date: October 5, 2023
    Applicant: SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY CHINESE ACADEMY OF SCIENCES
    Inventors: Long MENG, Wei ZHOU, Hairong ZHENG, Lili NIU, Zhengrong LIN, Benxian PENG, Farooq UMAR, Yingjian CUI