Patents by Inventor Beob PARK

Beob PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170301873
    Abstract: Disclosed herein is a flexible conductive substrate. According to the present invention, the flexible conductive substrate comprises a fabric substrate, a first film formed of metal or metal oxide on the fabric substrate, a second film formed of ITO film including tin oxide on the first film, and a third film formed of ITO film including tin oxide on the second film. A content of tin oxide included in the second film is smaller than that of oxide included in the third film.
    Type: Application
    Filed: January 28, 2015
    Publication date: October 19, 2017
    Inventors: Byoung Cheul PARK, Beob PARK, Soo-Heon KIM
  • Publication number: 20160190513
    Abstract: A flexible barrier fabric substrate includes a fabric base material, a planarization layer formed on the fabric base material, and a barrier layer formed on the planarization layer. One or more inorganic thin film layers and one or more polymer thin film layers are alternately stacked in the barrier layer.
    Type: Application
    Filed: December 29, 2015
    Publication date: June 30, 2016
    Inventors: Soo-Heon Kim, Byoung-Cheul Park, Beob Park
  • Publication number: 20150314326
    Abstract: Disclosed herein is a method for manufacturing a fabric substrate for a flexible display. According to the present invention, the method comprises the steps of preparing step for preparing a fabric substrate, calendering step for thermal stability and dimensional stability of the fabric substrate, a first coating step for coating a first planarization layer for planarizing the calendered fabric substrate, a plasma processing step for processing plasma to the first planarization layer, and a second coating step for coating a second planarization layer on the plasma-processed first planarization layer.
    Type: Application
    Filed: December 17, 2012
    Publication date: November 5, 2015
    Applicant: KOLON GLOTECH, INC.
    Inventors: Byong-Cheul PARK, Beob PARK, Kwang Taeg RYU