Patents by Inventor Ber Wu

Ber Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preventing metal extrusion in a semiconductor structure.
    Publication number: 20040058531
    Abstract: A method for preventing metal extrusion in a semiconductor structure is disclosed in this present invention. The point of this invention is that the first metal is suffered to a thermal process before the fabrication of a conformal glue layer into a via onto the first metal layer, and thus the first metal layer will not be extruded by thermal effect any more during the following processes. Therefore, this invention can provide a more efficient method for preventing metal extrusion in a semiconductor structure, and the phenomenon of the raising resistance caused by the metal extrusion can be avoided thereby.
    Type: Application
    Filed: August 8, 2002
    Publication date: March 25, 2004
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yen-Wu Hsieh, Shih-Lung Lee, Ber Wu, Wen-Shan Wei