Patents by Inventor Berhanu WONDIMU

Berhanu WONDIMU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONFORMABLE COLD PLATE FOR FLUID COOLING APPLICATIONS
    Publication number: 20240357774
    Abstract: Methods, systems, and apparatus described herein relate to a conformable cold plate for fluid cooling applications. An example method includes re-shaping a tube to contour non-uniform surfaces; and assembling a fluid cooling assembly using the re-shaped tube, the re-shaped tube capable to transfer fluid for cooling of one or more devices.
    Type: Application
    Filed: June 28, 2024
    Publication date: October 24, 2024
    Applicant: Intel Corporation
    Inventors: Berhanu Wondimu, David Shia, Xudong Tang
  • Conformable cold plate for fluid cooling applications
    Patent number: 12063759
    Abstract: Examples described herein relate to a sub-assembly for a fluid cooling system and the sub-assembly can include a fluid inlet, a fluid outlet, and at least one tube that is shaped to conform to surfaces of opposing dual inline memory modules (DIMMs). In some examples, the at least one tube is to connect to the fluid inlet and the fluid outlet. In some examples, the at least one tube includes a heat transferring material. In some examples, the DIMM includes memory devices and regions between memory devices. In some examples, the at least one tube is shaped with recesses to receive memory devices and shaped with protrusions to fit within the regions. In some examples, the at least one tube is formed as a re-shaped tube by shaping of a tube. In some examples, the re-shaped tube is formed by application of pressure within the tube and/or a vacuum external to the tube.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: August 13, 2024
    Assignee: Intel Corporation
    Inventors: Berhanu Wondimu, David Shia, Xudong Tang
  • DIMM COOLING ASSEMBLIES
    Publication number: 20240260233
    Abstract: Heat pipes and vapor chambers that are components of a DIMM cooling assembly are described.
    Type: Application
    Filed: November 11, 2021
    Publication date: August 1, 2024
    Inventors: Ming Zhang, Yuehong Fan, Peng Wei, Chuanlou Wang, Rajiv K. Mongia, Guocheng Zhang, Yingqiong Bu, Berhanu Wondimu, Guixiang Tan, Xiang Que, Qing Jiang, Liu Yu, Wei-Ming Chu, Chen Zhang, Hao Zhou, Feng Qi, Catharina Biber, Devdatta Prakash Kulkarni, Xiang Li, Yechi Zhang
  • CONFORMABLE COLD PLATE FOR FLUID COOLING APPLICATIONS
    Publication number: 20200344918
    Abstract: Examples described herein relate to a sub-assembly for a fluid cooling system and the sub-assembly can include a fluid inlet, a fluid outlet, and at least one tube that is shaped to conform to surfaces of opposing dual inline memory modules (DIMMs). In some examples, the at least one tube is to connect to the fluid inlet and the fluid outlet. In some examples, the at least one tube includes a heat transferring material. In some examples, the DIMM includes memory devices and regions between memory devices. In some examples, the at least one tube is shaped with recesses to receive memory devices and shaped with protrusions to fit within the regions. In some examples, the at least one tube is formed as a re-shaped tube by shaping of a tube. In some examples, the re-shaped tube is formed by application of pressure within the tube and/or a vacuum external to the tube.
    Type: Application
    Filed: July 13, 2020
    Publication date: October 29, 2020
    Inventors: Berhanu WONDIMU, David SHIA, Xudong TANG