Abstract: The invention relates to a circuit board (4) having a plurality of circuit board layers arranged one over the other. According to the invention, the circuit board layers are each made of a base material, the glass transition temperature of which is greater than or equal to 170° C., and the circuit board layers each have at least one thermally conductive layer (19 to 24) applied to the electrically insulating base material, wherein several vias (16, 17, 18) extending in a z-direction (z) perpendicularly to the circuit board layers are provided, which vias connect thermally conductive layers (19 to 24) of different circuit board layers in such a way that the vias (16, 17, 18) and the thermally conductive layers (19 to 24) of the circuit board layers form a thermally conductive bridge from a topmost circuit board layer to a bottommost circuit board layer. Furthermore, the invention relates to a control unit (1) for vehicle applications and to a use of the control unit (1).