Patents by Inventor Berin Seta

Berin Seta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260227761
    Abstract: The present invention provides a data-driven additive manufacturing (AM)—compression molding (CM) process in which a fiber-reinforced thermoplastic is deposited into a mold cavity and subsequently consolidated under heat and pressure. Deposition and molding parameters are selected using a numerical model to control microstructural characteristics and final part performance. Measured process data is fed to a control system to update the numerical model in real time. The control system is further configured to modify at least one AM or CM parameter based on a deviation between the measured process data and a model-predicted microstructural state. AM process parameters can include material flow rate, print speed, nozzle geometry, nozzle-to-substrate gap height, or material extrusion temperature. CM process parameters can include compression pressure, mold temperature, and compression timing after deposition.
    Type: Application
    Filed: January 30, 2026
    Publication date: August 6, 2026
    Inventors: Ahmed A. Hassen, Vipin Kumar, Vlastimil Kunc, Segun I. Talabi, Brittany Rodriguez, Komal Chawla, Uday K. Vaidya, Abdallah Ragab Barakat, Berin Seta, Jon Spangenberg