Patents by Inventor Berit Freudenberg

Berit Freudenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime
    Patent number: 7745327
    Abstract: By appropriately designing a plurality of deposition steps and intermediate sputter processes, the formation of a barrier material within a via opening may be accomplished on the basis of a highly efficient process strategy that readily integrates conductive cap layers formed above metal-containing regions into well-approved process sequences.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: June 29, 2010
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Axel Preusse, Michael Friedemann, Robert Seidel, Berit Freudenberg
  • METHOD OF FORMING A COPPER-BASED METALLIZATION LAYER INCLUDING A CONDUCTIVE CAP LAYER BY AN ADVANCED INTEGRATION REGIME
    Publication number: 20080206986
    Abstract: By appropriately designing a plurality of deposition steps and intermediate sputter processes, the formation of a barrier material within a via opening may be accomplished on the basis of a highly efficient process strategy that readily integrates conductive cap layers formed above metal-containing regions into well-approved process sequences.
    Type: Application
    Filed: October 12, 2007
    Publication date: August 28, 2008
    Inventors: Axel Preusse, Berit Freudenberg, Michael Friedemann
  • METHOD OF FORMING A COPPER-BASED METALLIZATION LAYER INCLUDING A CONDUCTIVE CAP LAYER BY AN ADVANCED INTEGRATION REGIME
    Publication number: 20080182406
    Abstract: By appropriately designing a plurality of deposition steps and intermediate sputter processes, the formation of a barrier material within a via opening may be accomplished on the basis of a highly efficient process strategy that readily integrates conductive cap layers formed above metal-containing regions into well-approved process sequences.
    Type: Application
    Filed: June 12, 2007
    Publication date: July 31, 2008
    Inventors: Axel Preusse, Michael Friedemann, Robert Seidel, Berit Freudenberg