Abstract: A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.

Abstract: An integrated circuit package assembly includes an integrated circuit, and a plurality of layers sealably connectable to each other to form a package having a cavity sized and shaped to receive the integrated circuit. Each layer is formed of a respective material. Each respective material is suitable for use as a printed circuit board substrate. At least one of the plurality of layers is a substrate having contacts that are connectable to electrical contacts of the integrated circuit. A bottom one of the layers has a plurality of ball attach pads, electrically connected to the contacts of the substrate.

Abstract: A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.