Patents by Inventor Bernard Berman

Bernard Berman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5593903
    Abstract: A method of forming contact pads (140) that allows for wafer level testing and burn-in of semiconductor die (22). A plurality of semiconductor die (22) are formed upon a semiconductor wafer (20), each semiconductor die (22) having a plurality of bonding pads (78). A contact pad (140) is formed overlying each bonding pad (78) and is electrically coupled to the bonding pad (78) and to wafer test pads (38) through vertical and/or horizontal wafer conductors (42-47 and 52-53 respectively) so that each semiconductor die (22) is uniquely identified. Contact pads (140) protect underlying bonding pads (78) during the formation and removal of vertical and/or horizontal wafer conductors (42-47 and 52-53 respectively). Thus, wafer level electrical testing and/or burn-in can be performed prior to designating a final packaging method for the semiconductor die (22).
    Type: Grant
    Filed: March 4, 1996
    Date of Patent: January 14, 1997
    Assignee: Motorola, Inc.
    Inventors: William M. Beckenbaugh, William H. Lytle, Bernard Berman