Abstract: An apparatus having an elongate hollow metal body extending along a longitudinal axis is disclosed. The hollow body defines a central opening and has a predetermined wall thickness. A pattern of laser cut slits is formed into the body. The slits define a plurality of articulatable elements. The plurality of articulatable elements enable active articulation of the body in a first plane and passive deflection in planes orthogonal to the first plane.

Abstract: An apparatus having an elongate hollow metal body extending along a longitudinal axis is disclosed. The hollow body defines a central opening and has a predetermined wall thickness. A pattern of laser cut slits is formed into the body. The slits define a plurality of articulatable elements. The plurality of articulatable elements enable active articulation of the body in a first plane and passive deflection in planes orthogonal to the first plane.

Abstract: Apparatus, system, and method for use with an endoscope are disclosed. A flexible overtube having a proximal end and a distal end defines a hollow lumen therebetween to receive a flexible shaft portion of an endoscope therein. The proximal end of the flexible overtube is configured to remain outside of a patient and the distal end is configured to enter the patient through a natural orifice. At least one fluid tight seal is located at the proximal end of the flexible overtube to prevent leakage of fluids around the flexible shaft of the endoscope when the flexible shaft of the endoscope is positioned within the flexible overtube. The system further includes a flexible endoscope. The method includes introducing the system into a patient though a natural orifice of the patient and performing an endoscopic translumenal procedure.

Abstract: A multi-lead surface mount interconnect. The interconnect includes a carrier, a first lead connected to the carrier, and a second lead connected to the carrier. The carrier defines a first receiving area and a second receiving area. The first lead includes a first planar surface for connection to a first printed circuit board and a second planar surface for connection to a second printed circuit board. The first planar surface is opposite the second planar surface. The second lead includes a third planar surface for connection to the first printed circuit board and a fourth planar surface for connection to the second printed circuit board. The third planar surface is opposite the fourth planar surface. The first planar surface is coplanar with the third planar surface. The second planar surface is coplanar with the fourth planar surface.

Abstract: A composition for forming an electrodeposited tin-lead alloy of controlled composition comprising:(a) about 1.5 to 1.8 percent by weight lead fluoroborate;(b) about 2.5 to 2.75 percent by weight tin fluoroborate;(c) about 91 to 92 percent by weight fluoroboric acid;(d) about 2.7 to 3.4 percent by weight boric acid; and(e) about 0.3 to 0.9 percent by weight Peptone,wherein the alloy comprises 62-64 weight percent tin and 36-38 weight percent lead.